Taiwan Semiconductor Manufacturing Comp. Ltd.

Chung-Sheng Hsiung

Chih-Kung Chang

Hung-Jen Hsu

Yu-Kung Hsiao

Yi-Ming Dai

Te-Fu Tseng

Fu-Tien Wong

Fu-Tien Weng

Bii-Junq Chang

Chin Chen Kuo

Chin-Chen Kuo

Jack Deng

Sheng-Liang Pan

Kuo-Liang Lu

Chiu-Kung Chang

Sung-Yung Yang

Po-Wen Lin

A method is provided for processing a substrate. The substrate has at least one filter region, a plurality of bond pads, and a plurality of scribe lines arranged around the filter region and bond pads. A first planarization layer is formed above the substrate. The planarization layer has a substantially flat top surface overlying the filter region, the bond pads and the scribe lines. At least one color resist layer is formed over the first planarization layer and within the filter region while the first planarization layer covers the bond pads and the scribe lines.

Image sensor

Image sensor fabrication method and structure

An image sensor improving the uniformity of effective incident light. In one example, the size of microlenses disposed in different regions of the image sensor is changed to balance the brightness in different regions, in which the size of each microlens is a function of the distance between the microlens to the chip center In another example, the distance between the center of the microlens and the center of the corresponding sensing area is changed to balance the brightness in different regions and the corresponding color filters are shifted such that the microlens is overlying a corresponding color filter unit without overlying adjacent regions thereof, in which the distance between the center of the microlens and the center of the corresponding sensing area is a function of the distance between the corresponding sensing area to the chip center.

Image sensor with improved uniformity of effective incident light

A method for fabricating a microelectronic product provides for forming a planarizing layer upon a bond pad and a topographic feature, both formed laterally separated over a substrate. The planarizing layer is formed with a diminished thickness upon the bond pad such that it may be readily etched to expose the bond pad while employing as a mask an additional layer formed over the topographic feature but not over the bond pad. The method is particularly useful for forming color filter sensor image array optoelectronic products with attenuated bond pad corrosion.

Method for fabricating microelectronic product with attenuated bond pad corrosion

Within a method for forming a color filter image array optoelectronic microelectronic fabrication, and the color filter image array optoelectronic microelectronic fabrication formed employing the method, there is provided a substrate having formed therein a series of photo active regions. There is also formed over the substrate at least one color filter layer having formed therein a color filter region having a concave upper surface. There is also formed upon the at least one color filter layer and planarizing the at least one color filter region having the concave upper surface, a planarizing layer. The planarizing layer provides for enhanced resolution of the color filter image array optoelectronic microelectronic fabrication.

Color filter image array optoelectronic microelectronic fabrication with a planarizing layer formed upon a concave surfaced color filter region

Growing community of inventors

Zhudong Town, Taiwan

Chung-Sheng Hsiung