Intel Corporation

Chung Peng (Jackson) Kong

Telesphor Kamgaing

Ping Ping Ooi

Chang-Tsung Fu

Chan Kim Lee

'Hybrid' transmission line circuits employing multiple interconnect levels for the propagation, or return, of a single signal line across a package length are described. In package transmission line circuit embodiments, a signal line employs co-located traces in two different interconnect levels that are electrically coupled together. In further embodiments, a reference plane is provided above, below or co-planar with at least one of the co-locate traces. In embodiments, a balanced signal line pair includes first and second co-located traces in two adjacent interconnect levels as a propagation signal line and third and fourth co-located traces in the two adjacent interconnect levels as a return signal line with a ground plane co-planar with, and/or above and/or below the two adjacent interconnect levels.

Growing community of inventors

Tanjung Tokong, Malaysia

Chung Peng (Jackson) Kong