Industrial Technology Research Institute

Chung-Lun Kuo

Chih-Hsiang Liu

Hsiang-Chun Wei

Chun-Wei Lo

Yan-Rung Lin

Chia-Hung Cho

Chieh-Yi Lo

Yi-Sha Ku

Shie-Chang Jeng

Chia-Liang Yeh

Hsin-Cheng Lin

Yu-Ying Lan

Hsiao-Wei Liu

Wei-Hsiung Tsai

Yeou-Sung Lin

A measurement system including an excitation light source, an image sensor, and a calculator is provided. The excitation light source is configured to emit an excitation light beam. The image sensor is configured to record an image of the excitation light beam passing through a glass substrate having a plurality of vias. The image is a 2D interference pattern. The calculator is electrically connected to the image sensor. The calculator analyzes a 3D geometric-structure image of the vias in the glass substrate according to the image. A measurement method is also provided.

Measurement system and measurement method

A method for inspecting LED dies includes the following steps. First electrodes and second electrodes of LED dies to be inspected are short-circuited via a conductive layer on an inspection substrate, or an inspection bias voltage is applied between the first electrodes and the second electrodes of the LED dies. An excitation light is irradiated on the LED dies to be inspected on the inspection substrate such that the LED dies to be inspected emit a secondary light. When the first electrodes and the second electrodes of the LED dies to be inspected are open, short-circuited, and/or subjected to the inspection bias voltage, the secondary light is captured via an optical sensor. An output of the optical sensor is received via a computer and a spectrum difference of the secondary light is calculated to determine whether the LED dies are abnormal or to classify the LED dies to be inspected.

Apparatus and method for inspecting light-emitting diode dies

A method of training AI for label-free cell viability determination includes a step of providing a cell sample, a step of obtaining a fluorescence image and a DHM image of the cell sample, a step of determining a first cell viability of the cell sample according to the fluorescence image of the cell sample, a step of labeling the DHM image of the cell sample as a model specifying the first cell viability, and a step of performing AI training by using the model containing the DHM image of the cell sample.

Method of training AI for label-free cell viability determination and label-free cell viability determination method by trained AI

A heterogeneous integration detecting method and a heterogeneous integration detecting apparatus are provided. The heterogeneous integration detecting method includes the following. Under the condition of maintaining the same relative distance between an interference objective lens and a sample, the relative posture of the interference objective lens and the sample is continuously adjusted according to the change of an image of the sample in the field of view of the interference objective lens until a first optical axis of the interference objective lens is determined to be substantially perpendicular to the surface of the sample according to the image. The interference objective lens is replaced with an imaging objective lens and the geometric profile of at least one via of the sample is detected. A second optical axis of the imaging objective lens after replacement overlaps with the first optical axis of the interference objective lens before replacement.

Heterogeneous integration detecting method and heterogeneous integration detecting apparatus

An inspection apparatus for inspecting a light-emitting diode wafer is provided. The inspection apparatus includes a Z-axis translation stage, a sensing probe, a height measurement module, a carrier, an illumination light source, and a processing device. The sensing probe is integrated with the Z-axis translation stage. The Z-axis translation stage is adapted to drive the sensing probe to move in a Z axis. The sensing probe includes a photoelectric sensor, a beam splitter, and a photoelectric sensing structure. One of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam penetrating the beam splitter, and the other one of the photoelectric sensor of the sensing probe and the height measurement module is adapted to receive a light beam reflected by the beam splitter. The carrier is configured to carry the light-emitting diode wafer. The illumination light source is configured to emit an illumination beam to irradiate the light-emitting diode wafer. An inspection method for inspecting light-emitting diodes is also provided.

Inspection apparatus and inspection method for inspecting light-emitting diodes

An optical measurement system comprises a polarization beam splitter for dividing an incident beam into a reference beam and a measurement beam, a first beam splitter for reflecting the measurement beam to form a first reflected measurement beam, a spatial light modulator for modulating the first reflected measurement beam to form a modulated measurement beam, a condenser lens for focusing the modulated measurement beam to an object to form a penetrating measurement beam, an objective lens for converting the penetrating measurement beam into a parallel measurement beam, a mirror for reflecting the parallel measurement beam to form an object beam, a second beam splitter for reflecting the reference beam to a path coincident with that of the object beam, and a camera for receiving an interference signal generated by the reference beam and the object beam to generate an image of the object.

Optical measurement system for obtaining and analyzing surface topography of object

An inspection apparatus including an illumination light source, a sensing probe and a processing device is provided. The illumination light source emits an illumination beam to simultaneously irradiate the plurality of light-emitting diode. The sensing probe is configured to measure a charge distribution, an electric field distribution, or a voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. The processing device determines a plurality of electro-optical characteristics of the plurality of light-emitting diodes through the charge distribution, the electric field distribution, or the voltage distribution on the plurality of light-emitting diodes simultaneously irradiated by the illumination beam. Moreover, a method of for inspecting light-emitting diodes is also provided.

Method for inspecting light-emitting diodes and inspection apparatus

An eye tracking apparatus and an eye tracking method for the eye tracking apparatus are provided. The eye tracking apparatus includes an image capture device and a computing device. The image capture device is adapted to capture at least one face image. The computing device is coupled to the image capture device. The computing device receives the face image to obtain an eye image and identifies at least one iris region of the eye image. The computing device chooses the largest iris region from the iris regions to obtain a fitting pattern of the largest iris region and obtains a gaze point of the eye image based on the fitting pattern.

Growing community of inventors

Taipei, Taiwan

Chung-Lun Kuo