Intel Corporation

Chung Lam

John B Halbert

Randy M Bonella

Jim M Dodd

James M Dodd

James A McCall

Michael W Williams

Thomas J Holman

Providing electrical isolation between the chipset and the memory data is disclosed. The disclosure includes providing at least one buffer in a memory interface between a chipset and memory modules. Each memory module includes a plurality of memory ranks. The buffers allow the memory interface to be split into first and second sub-interfaces. The first sub-interface is between the chipset and the buffers. The second sub-interface is between the buffers and the memory modules. The method also includes interleaving output of the buffers, and configuring the buffers to properly latch the data being transferred between the chipset and the memory modules. The first and second sub-interfaces operate independently but in synchronization with each other.

Buffering and interleaving data transfer between a chipset and memory modules

Methods and apparatus for a memory system using a new memory module architecture are disclosed. In one embodiment, the memory module has two ranks of memory devices, each rank connected to a corresponding one of two 64-bit-wide data registers. The data registers connect to two 64-bit-wide ports of a 128:64 multiplexer/demultiplexer, and a 64-bit-wide data buffer connects to the opposite port of the multiplexer/demultiplexer. A controller synchronizes the operation of the data registers, the multiplexer/demultiplexer, and the data buffer. In an operating environment, the data buffer connects to a memory bus. When a data access is performed, both ranks exchange data signaling with their corresponding data registers during a single data access. At the buffer, the memory bus data transfer occurs in two consecutive clock cycles, one cycle for each rank. This allows the memory bus transfer rate to double for the same memory bus width and memory device speed.

Dual-port buffer-to-memory interface

Buffering data transfer between a chipset and memory modules is disclosed. The disclosure includes providing and configuring at least one buffer. The buffers are provided in an interface between a chipset and memory modules. The buffers allow the interface to be split into first and second sub-interfaces. The first sub-interface is between the chipset and the at least one buffer. The second sub-interface is between the at least one buffer and the memory modules. The buffers are then configured to properly latch the data being transferred between the chipset and the memory modules. The first and second sub-interfaces operate independently but in synchronization with each other.

Buffering data transfer between a chipset and memory modules

Methods and apparatus for a memory system using a new memory module architecture are disclosed. In one embodiment, the memory module has two ranks of memory devices, each rank connected to a corresponding one of two 64-bit-wide data registers. The data registers connect to two 64-bit-wide ports of a 120:64 multiplexer/demultiplexer, and a 64-bit-wide data buffer connects to the opposite port of the multiplexer/demultiplexer. A controller synchronizes the operation of the data registers, the multiplexer/demultiplexer, and the data buffer. In an operating environment, the data buffer connects to a memory bus. When a data access is performed, both ranks exchange data signaling with their corresponding data registers during a single data access. At the buffer, the memory bus data transfer occurs in two consecutive clock cycles, one cycle for each rank. This allows the memory bus transfer rate to double for the same memory bus width and memory device speed.

A plurality of memory modules interface through a daisy-chain providing a point-to-point connection for each memory module. The first and the last memory module in the daisy chain each connect to a separate memory controller port forming a ring circuit. A distinct set of signals connect the memory modules in each direction. A junction circuit in each memory module provides line isolation, a coupling to the adjoining memory modules in the daisy chain, or in the case of the first and last memory module in the daisy chain, a memory module and a memory controller, and a data synchronization circuit. Each junction circuit provides as well as voltage conversion so that the memory devices on a memory module operate at a different voltage than the memory controller, and multiplexing/de-multiplexing so that a lesser number of lines interface with each junction circuit.

Memory module employing a junction circuit for point-to-point connection isolation, voltage translation, data synchronization, and multiplexing/demultiplexing

Providing electrical isolation between the chipset and the memory data is disclosed. The disclosure includes providing at least one buffer in a memory interface between a chipset and memory modules. Each memory module includes a plurality of memory ranks. The at least one buffer allows the memory interface to be split into first and second sub-interfaces. The first sub-interface is between the chipset and the buffer. The second sub-interface is between the buffer and the memory modules. The method also includes interleaving output of the memory ranks in the memory modules, and configuring the at least one buffer to properly latch data being transferred between the chipset and the memory modules. The first and second sub-interfaces operate independently but in synchronization with each other.

Buffer to multiply memory interface

Methods and apparatus for a memory system using a branching point-to-point memory bus architecture are disclosed. In one embodiment, a primary memory controller maintains a point-to-point bus connection with one memory module and that memory module maintains a separate point-to-point bus connection with a second module. Data passing between the memory controller and the second memory module passes through a buffer circuit on the first memory module. For data received from the memory controller, the buffer circuit also passes that data up a module bus segment to a first bank of memory devices. That bank of memory devices maintains a second module bus segment with a second bank of memory devices. Data passing between the buffer circuit and the second bank of memory devices passes through a pass-through circuit on the first bank of memory devices. In this manner, a point-to-point memory bus architecture can be maintained even when a memory module contains more than one bank of memory devices.

Growing community of inventors

Redwood City, CA, United States of America

Chung Lam