Samsung Electronics Co., Ltd.

Chung-Koo Yoon

Jong-Hyun Kim

Sang-Jun Park

Chang-Nyun Kim

Sun-Ju Kim

Hyun-Ho Park

Nam-Sik Jeong

A test system for a semiconductor device couples the device to the back side of a circuit board, thereby allowing the device to be tested under actual operating conditions while providing adequate clearance around the device to accommodate automatic handling equipment, and also reducing signal delay and distortion. A system in accordance with the present invention includes a circuit board having circuitry adapted to provide an actual operating environment for the semiconductor device, as for example, a low cost mother board for testing memory devices. The device is coupled to the back side of the circuit board through test terminals formed on the back side of the board. An interface board can be used to correct the pin arrangements, which are reversed because they protrude from the back side of the board, and to compensate for the environmental differences caused by use of sockets and additional equipment on the interface board.

Method and apparatus for testing semiconductor devices using the back side of a circuit board

Semiconductor devices are tested under actual operating conditions by interfacing the devices to an actual board-type product, for example, through a test board tat includes a mounting unit such as a socket or pattern of conductive lands that allows the devices being tested to be mounted to and removed from the test board with minimal effort and signal degradation. An interface circuit on the test board compensates for environmental differences between the board-type product and the mounting unit. For example, the interface circuit can include a clock distribution circuit, which utilizes a phase locked loop, and a register circuit to compensate for electrical loading caused by the device mounting unit, and to provide the proper timing margins between clock signals and control signals applied to the semiconductor devices. A power control circuit can be used to manipulate the supply voltage thereby providing a voltage margin screening function.

Method and apparatus for testing semiconductor devices using an actual board-type product

Embodiments of the invention allow semiconductor devices to be tested under actual operating conditions by interfacing the devices to an actual board-type product. The devices are interfaced to the board-type product with a test board that includes a mounting unit such as a socket or pattern of conductive lands that allows the devices to be easily mounted to and removed from the test board with minimal effort and signal degradation. An interface circuit on the test board compensates for environmental differences between the board-type product and the mounting unit. A power control circuit can be used to manipulate the supply voltage applied to the semiconductor devices, thereby providing a voltage margin screening function.

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Seoul, South Korea

Chung-Koo Yoon