Taiwan Semiconductor Manufacturing Comp. Ltd.

Global Unichip Corporation

Chung-Kai Wang

Ming-Che Wu

Yu-Ru Chang

Ting-Hao Wang

Igor Elkanovich

Ting-Hsu Chien

Pei Yu

Jia-Liang Chen

Tsai-Ming Yang

Yen-Chung Tony Chen

Amnon Parnass

Chia-Hsiang Chang

Yuan-Hung Lin

Yu-Ju Chang

Ting-Chin Cho

Li-Hua Lin

Li-Ya Tseng

Chao-Ching Huang

Yen-Wei Chen

Zanyu Yang

Chun-Hsu Chen

An interface of integrated circuit (IC) die includes a plurality of the contact elements formed as a contact element pattern corresponding to a parallel bus. The contact elements are arranged in an array of rows and columns and divided into a transmitting group and a receiving group. The contact elements of the transmitting group have a first contact element sequence and the contact elements of the receiving group have a second contact element sequence, the first contact element sequence is identical to the second contact element sequence. The contact elements with the first contact element sequence and the second contact element sequence are matched when the contact element pattern is geometrically rotated by 180&#xb0; with respect to a row direction and a column direction.

Interface of integrated circuit die and method for arranging interface thereof

A device includes a spacer, which includes a recess extending from a top surface of the spacer into the spacer, and a conductive feature including a first portion and a second portion continuously connected to the first portion. The first portion extends into the recess. The second portion is on the top surface of the spacer. A die is attached to the spacer, and a lower portion of the first die extends into the recess.

Functional spacer for SIP and methods for forming the same

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Taipei, Taiwan

Chung-Kai Wang