Other

Taiwan Semiconductor Manufacturing Comp. Ltd.

Chung-I Cheng

Chih-Chiang Yang

Yu-Chia Chang

Chung-Yang Lin

Yu-Sheng Shen

Pei Wei Yeh

Jain-Li Wu

Young-Wang Lo

Yung-Tai Tseng

An apparatus and a method for retaining moisture on a polishing pad in chemical mechanical polishing during machine idling, i.e. during machine maintenance or repair are described. The apparatus is constructed of a circular disc in a clam-shell configuration having two halves for easy mounting or dismounting from a polishing pad. The circular disc may further include a protruded top portion to accommodate a polishing head when the chemical mechanical polishing apparatus is in a stand-by mode. The circular disc should have a diameter sufficiently large to cover an entire surface area of a polishing pad, while a peripheral edge of the circular disc overlaps a periphery of the polishing pad. The apparatus further includes a moisture retention means mounted on an inner surface of the circular disc for providing a moisturizing environment to the surface of the polishing pad. The moisture retention means can be suitably provided in brushes formed of moisture retaining bristles or in a cellulosic material layer. The apparatus may further include a fastening means for fastening the two clam-shell halves together which includes a hook-and-loop means, an adhesive means or a mechanical quick connect/disconnect means. The circular disc is preferably fabricated of a substantially transparent material, such as a transparent plastic, so that the condition of the polishing pad can be readily observed.

Apparatus and method for retaining moisture on a polishing pad

The present invention discloses a method for preventing particle contamination in a polishing machine that utilizes slurry composition for the removal of material from the surface of a substrate. The novel method is particularly suited for use in a chemical mechanical polishing apparatus in which a slurry composition is used. The method includes the step of providing a plurality of cleaning devices each having a bendable, shapable conduit and a spray nozzle for dispensing a cleaning solvent on the spindle and the conditioner arm utilized in the CMP apparatus. The present invention further discloses an apparatus for use in carrying out a method for preventing particle contamination in a CMP apparatus by using bendable, shapable conduits for dispensing a cleaning solvent such as deionized water onto the chamber components for removing slurry deposits that may have splattered thereon and therefore, eliminating sources for particle contamination.

Method and apparatus for preventing particle contamination in a polishing machine

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Hsin-Chu, Taiwan

Chung-I Cheng