Keycore Technology Corp.

Chung-Hsin Liu

Wei-Cheng Lin

Shih-Hsiu Tseng

Chien-Jen Hsiao

A multi-chip packaging structure employing millimeter wave includes a substrate material, a first and a second substrate board and an adhesive layer. The substrate material has a first metal pad. The first substrate board has a first and a second integrated circuit, multiple first metal wirings and multiple second metal pads, which are layer-by-layer stacked and electrically connected. The first and second metal pads are electrically connected via at least one metal lead. The adhesive layer is disposed between the substrate material and the first substrate board. The second substrate board has a third and a fourth integrated circuit, multiple second metal wirings and multiple third metal pads, which are layer-by-layer stacked and electrically connected. The electro-conductive boss blocks are respectively electrically connected with the second and third metal pads. Chips and antennas are integrated to integrate signal height and avoid interference and minify the volume.

Multi-chip packing structure employing millimeter wave

A millimeter wave power amplifier device has multiple millimeter wave power amplifier circuits. Each millimeter wave power amplifier circuit includes a transistor, a first serial connection resonation unit, a second serial connection resonation unit, multiple first frequency band adjustment units and multiple second frequency band adjustment units. The transistor has a first end connected with an input end, a second end connected with a grounding end and a third end connected with an output end. Each of the first and second frequency band adjustment units has a switch member and two storage members. The switch member and the storage members of the first and second frequency band adjustment units are serially connected. The millimeter wave power amplifier device can achieve multi-frequency band adjustable effect to lower the cost.

Growing community of inventors

Zhubei, Taiwan

Chung-Hsin Liu