Winbond Electronics Corporation

Chung-Hsin Lai

Chen-Wei Liao

Cheng-Chieh Shen

Chien-Yen Liu

A method of monitoring a semiconductor process includes the following steps. A process parameter is set to a first condition. A first process is performed to form a first film layer on a first wafer. The first film layer does not cover a wafer edge region of the first wafer. The first wafer having the first film layer is photographed by an image capturing device to obtain a first wafer image. Image recognition is performed to the first wafer image to obtain first data. Whether a position of the first film layer is offset is determined according to the first data.

Growing community of inventors

Taichung, Taiwan

Chung-Hsin Lai