Luxnet Corporation

Chung Hsin Fu

Chi-Min Ting

Yun-Cheng Huang

Tsing-Chow Wang

Chien-Wen Lu

Shu Chun Chang

Ya Chuan Lin

Yun Cheng Huang

Nai-Xin Chen

Hua Hsin Su

The invention provides a package structure of optical connector, comprising: an input circuit board, an output circuit board, a flexible circuit board, an optical transceiver module, and an enclosure for packing the above components. The input/output circuit board comprises a connecting terminal and an input/output terminal comprising a plurality of input/output ports, wherein the input circuit board and the output circuit board are fixed by the two opposite sides of the enclosure to create a specific space between the input circuit board and the output circuit board. The flexible circuit board is electrically connected to the connecting terminal of the input circuit board and/or the connecting terminal of the output circuit board. The optical transceiver module is electrically connected to the input circuit board and the output circuit board. The enclosure comprises an electrical connecting opening and an optical connecting opening corresponding to the electrical connecting opening.

Package structure of optical connector

An optical transmitter package structure, comprising: a base, a circuit substrate, and a cylindrical light-coupling mechanism. The optical transmitter package structure of the present invention has following advantageous effects: once the packaging process of the optical transmitter of the present invention is completed, the resulting structure is compact and airtight. Consequently, the optical transmitter is well protected against moisture during use and has a long service life; the optical transmitter of the present invention has a sturdy overall structure which is resistant to damage by improper operation during assembly.

Optical transmitter package structure

The invention provides a package structure of optical transceiver component, comprising: a metal base; a plurality of pins, at least one optical emitting diode and/or at least one optical receiving diode; wherein the pins are provided and passed through the metal base and insulated with the metal base by using an insulating material; the optical emitting diode and the optical receiving diode are each mounted on the metal base through a sub-mount, respectively. The optical emitting diode/optical receiving diode is connected to the pins neighboring therewith by a wire directly or through the sub-mount, when set the top surface of the pins be a reference level, at least one of the top surfaces of the optical emitting diode, the optical receiving diode, and sub-mount is flush with the reference level.

Package structure of optical transceiver component

The present invention provides an optical transceiver module, comprising: a circuit substrate; a z-axis positioning base connected to the circuit substrate that, wherein the z-axis positioning base comprises two first sides respectively provided on two lateral sides of the optical transceiver sub-module, a second side provided between and connecting the two first sides, an opening corresponding in position to a side of the optical transceiver sub-module that faces away from the second side, and a step difference provided on each of the two first sides and the second side; a fiber-optic lens element provided on the z-axis positioning base and comprises a cover and a fiber-optic lens sub-module, wherein the cover comprises a recess and step differences surrounding the recess and respectively corresponding in position to the step differences provided on the z-axis positioning base, so as for the cover to be fitted on the z-axis positioning base.

Optical transceiver module

Jewelry armoire

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Zhongli, Taiwan

Chung Hsin Fu