Intel Corporation

Apple Inc.

Chung-Hao Chen

Hao-Han Hsu

Jaejin Lee

Dong-Ho Han

Songnan Yang

Xiang Li

Li-Sheng Weng

Kuan-Yu Chen

Kemal Aygun

Mitul Bharat Modi

Yun Ling

Ana M Yepes

Emile Davies-Venn

Pujitha Davuluri

Min Keen Tang

Jackson Chung Peng Kong

Ulun Karacaoglu

Hong W Wong

Anand S Konanur

Kaladhar Radhakrishnan

James Chris Matayabas, Jr

Howard L Heck

James Utz

Alexander Uan-Zo-Li

Xiaoguo Liang

Zhen Yao

Jianfang Olena Zhu

Bradley Alan Jackson

Jonathan Rosenfeld

Sreenivas Kasturi

Bin Xiao

Jun Liao

Wei Qian

Mohd Muhaiyiddin Bin Abdullah

Srinivas Thota

Vijay Kasturi

Shyamjith Mohan

Chi-Te Chen

Long Wang

Xing Jian Cai

Sheng Ren

Mike Schaffer

Yihong Yang

Jue Chen

Su Mi Sam

Some embodiments include apparatuses and electrical models associated with the apparatus. One of the apparatuses includes an integrated circuit having a die; a package substrate; first conductive connections coupled between the die and a first side of the package substrate; second conductive connections located on a second side of the package substrate opposite from the first side. The second conductive connections are coupled to the first conductive connections through conductive paths in the package substrate. The first conductive connections and the conductive connections are associated with an S-parameter of an electrical model of the integrated circuit package. The electrical model further includes at least one of a current value associated with a power rail of the integrated circuit package, an impedance target associated with a location at the integrated circuit package, and a mapping associated with the first and second conductive connections.

Platform power integrity design including package standard power integrity model and compact voltage regulator module model

A microelectronic package may be fabricated with a microelectronic substrate, a microelectronic die electrically attached to the microelectronic substrate, and an electromagnetic interference shield layer contacting one or both of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between about 10,000 siemens per meter and 100,000 siemens per meter. The specific range of electrical conductivity results in electromagnetic fields either generated by the microelectronic die or generated by components external to the microelectronic package scattering within the electromagnetic interference shield layer and attenuating. Thus, the electromagnetic interference shield layer can prevent electromagnetic field interference without the need to be grounded.

Microelectronic package having electromagnetic interference shielding

Techniques for focusing the energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a ferrite structure disposed below the transmit coil, the ferrite structure comprising a flat sheet and a projection of ferrite material projecting above the flat sheet.

Field shaper for a wireless power transmitter

Semiconductor packages and a method of forming a semiconductor package are described. The semiconductor package has a foundation layer, a conductive layer formed in the foundation layer, and a magnetic layer formed between the conductive and the foundation layer. The conductive layer and the magnetic layer are coupled to form a low-profile inductor shield. The semiconductor package also has a dielectric layer formed between the magnetic and foundation layer. The foundation layer is mounted between a motherboard and a semiconductor die, where the foundation layer is attached to the motherboard with solder balls. Accordingly, the low-profile inductor shield may include a z-height that is less than a z-height of the solder balls. The low-profile inductor shield may have solder pads that are coupled to the conductive layer. The foundation layer may include at least one of voltage regulator and inductor, where the inductor is located above the low-profile inductor shield.

Ultra-low profile package shielding technique using magnetic and conductive layers for integrated switching voltage regulator

Disclosed is a microelectronics package. The microelectronics package may include a reference plane, a signal routing layer, a dielectric layer, and a conductive layer. The signal routing layer may include a plurality of signal routing traces. The dielectric layer may be located adjacent to the signal routing layer. The conductive layer may be applied to the dielectric layer such that the dielectric layer is located in between the signal routing layer and the conductive layer. The conductive layer may be in electrical communication with the reference plane.

Conductive coating for a microelectronics package

An electromagnetic interference (EMI) shielding can be couplable to a circuit board. The EMI shielding can include a fence couplable to the circuit board, a lid couplable to the fence, and a shield arm extending from the lid and being configured to couple to the fence. The shield arm can be hingedly or rotatably coupled to the lid. The shield arm can be magnetically couplable to the lid. The shield arm and/or the fence can include a magnet to provide a magnetic attraction between the shield arm and the fence.

Electromagnetic interference shielding having a magnetically attracted shield arm

Techniques for focusing an energy radiated by a wireless power transmitting unit are described. An example power transmitting unit includes a transmit coil configured to generate a magnetic field to wirelessly power a device within an active wireless charging area. The power transmitting unit also includes a power generating circuitry to deliver a current to the transmit coil to generate the magnetic field. The power transmitting unit also includes a patch array disposed in parallel with the transmit coil to reduce a strength of the magnetic field at frequencies outside of the operating frequency during operation of the power transmitting unit.

Shield for a wireless power transmitter

An apparatus is provided which comprises: an oscillator circuit to generate a clock signal and transmit the clock signal over a signal line; a ground reference plane associated with the signal line; and one or more patterns formed in the ground reference plane, wherein the one or more patterns in the ground reference plane is to filter out noise from the clock signal transmitted over the signal line.

Radio frequency interference mitigation in crystal oscillator circuitry

An apparatus for electromagnetic interference shielding is described herein. The apparatus includes an electromagnetic bandgap (EBG) structure. The EBG structure is attached to a surface of the apparatus such that noise propagation is mitigated. The apparatus may be a chassis of an electronic device, and the EBG structure may be attached to one surface of the chassis. Further, the apparatus may be a heat sink, and the EBG structure can be attached to one surface of the heat sink.

EBG designs for mitigating radio frequency interference

Electronic device packages utilizing a stiffener coupled to a substrate with a magnetic lossy bonding layer to attenuate or absorb electromagnetic signals such as radio frequency interference (RFI) along with related systems and method are disclosed.

Electronic device packages with attenuated electromagnetic interference signals

Techniques and mechanisms for interconnecting circuitry disposed on a transparent substrate. In an embodiment, a multilayer circuit is bonded to the transparent substrate, the multilayer circuit including conductive traces that are variously offset at different respective levels from a side of the transparent substrate. Circuit components, such as packaged or unpackaged integrated circuit devices, are coupled each to respective input and/or output (IO) contacts of the multilayer circuit, where the conductive traces and the IO contacts interconnect the circuit components with each other. In another embodiment, the multilayer circuit is a flexible circuit that is bent to interconnect circuit components which are disposed on opposite respective sides of the transparent substrate.

Device, system and method to interconnect circuit components on a transparent substrate

Apparatus and method to provide integrated circuit (IC) package integrity without adverse performance degradation are disclosed herein. In some embodiments, an apparatus may include one or more integrated circuits (ICs); a metallic structure that encircles the one or more ICs without being in contact with the one or more ICs, wherein the metallic structure is without an electrical ground; and a conductive epoxy layer disposed below and in contact with the metallic structure, wherein the conductive epoxy is to reduce an electromagnetic field induced by the metallic structure in response to a presence of a wireless signal that operates at approximately a resonant frequency associated with the metallic structure.

Integrated circuit package including floating package stiffener

A retention apparatus for a shielded cable is described. In one embodiment, the apparatus comprises a substrate having a ground; a connector coupled to the substrate; a cable shielded with a conductive material and having an end connectable to the connector to electrically connect with the connector; an electrically conductive material coupled to the ground of the substrate; and a grounding retention mechanism to cause the electrically conductive material to electrically connect the cable to the ground of the substrate by applying a force to the cable shield.

Retention mechanism for shielded flex cable to improve EMI/RFI for high speed signaling

A patch-based proximity sensor having a capacitance and/or inductance that varies based on a proximity of an animate body, a sense circuit to sense the capacitance and/or inductance, and a control system to compare one or more sensed values to one or more thresholds, and to selectively enable/disable one or more antennas based on the comparison(s). The threshold may correspond to a desired/permitted minimum distance between an antenna and an animate body, and/or a desired/permitted maximum electromagnetic energy exposure to the animate body. A multi-layer module may include one or more patch-based proximity sensors and one or more patch-antennas. Multiple antennas may be individually controllable based on corresponding proximity measures.

Patch-based proximity sensors, antennas, and control systems to control antennas based on corresponding proximity measures

Growing community of inventors

Portland, OR, United States of America

Chung-Hao Chen