Samsung Electro-mechanics Co., Ltd.

Chung Eun Lee

Jong Ho Lee

Doo Young Kim

Doo Il Kim

Jae Yeol Choi

Hong Seok Kim

Jae Sung Park

Hang Kyu Cho

Wi Heon Kim

Jong Han Kim

Myung Jun Park

Hyun Hee Gu

Chang Sik Kim

Hyoung Uk Kim

Jin Soo Park

Bum Soo Kim

Duk Hyun Chun

Yeon Song Kang

Ho Sam Choi

Chul Woo Lee

Seok Kyoon Woo

Hee Sun Chun

Seung In Baik

Jin Hyung Lim

Kyung Ryul Lee

Soo Kyong Jo

Hyung Joon Jeon

Ji Su Hong

Eun Ha Jang

In Tae Seo

Jeong Yun Park

Jae Won Kim

Eun Joo Choi

So Hyeon Hong

Kyu Jeong Sim

Dong Chan Kim

Seung Min Kang

Ji Ye Choi

Hye Bin Kim

Eun Jeong Cho

Ki Han Kim

Sun Ju Hwang

A dielectric material includes a main component represented by (BaCa)(Ti(Zr, Sn, Hf))O(0≤x≤1 and 0≤y≤0.5); a first subcomponent including at least one of elements among Y, Dy, Ho, Er, Gd, Ce, Nd, Nb, Sm, Tb, Eu, Tm, La, Lu, and Yb; a second subcomponent including Si and/or Al; and a third subcomponent including Ba and/or Ca.

Dielectric material and multilayer ceramic electronic component including the same

A dielectric composition and a multilayer capacitor including the same are provided. The dielectric composition includes a BaTiO-base main component, a first subcomponent including an Nb component and a Gd component, a second subcomponent including an Mg component, and a third subcomponent including a Ba component and a Ca component. The first subcomponent is included in an amount of 4 moles or less per 100 moles of the main component. In the first subcomponent, a molar content of Nb and a molar content of Gd satisfy 0.33≤Nb/Gd, and in the third subcomponent, a molar content of Ba and a molar content of Ca satisfy 0.2≤Ca/(Ba+Ca).

Dielectric composition and multilayer capacitor

A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.

Multilayer electronic component

A multilayer electronic component includes: a body including dielectric layers; side margin portions disposed on side surfaces of the body, respectively; and external electrodes disposed on end surfaces of the body, respectively. The body includes a capacitance forming portion including internal electrodes disposed alternately with the dielectric layers and cover portions disposed on upper and lower surfaces of the capacitance forming portion, respectively. Ga2/Ga1 is 0.8 or more and less than 1.0 and Ga2/Gc1 is 0.8 or more and less than 1.0. a1 is a central portion of the capacitance forming portion, a2 is a boundary portion between the capacitance forming portion and the cover portion in the capacitance forming portion, and c1 is a boundary portion between the capacitance forming portion and the cover portion in the cover portion. Ga1, Ga2, and Gc1 are average sizes of dielectric grains at a1, a2, and c1, respectively.

A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are provided and a plurality of internal electrodes are stacked with the dielectric layer interposed therebetween and external electrodes disposed outside the body and connected to the plurality of internal electrodes. The body includes a high resistance portion disposed in at least one region between the dielectric layer and the internal electrode and inside the dielectric layer and having electric resistance higher than electric resistance of the internal electrode, and the high resistance portion and the plurality of internal electrodes include the same metal component and the same metal oxide component.

Multilayer capacitor

Multilayer electronic component and manufacturing method thereof

A multilayer ceramic electronic component includes: a ceramic body including an active portion having dielectric layers and first and second internal electrodes and first and second cover portions disposed on opposite surfaces of the active portion in a stacking direction, respectively; wherein when a region of the cover portion in contact with the first or second internal electrode is an inner region of the cover portion and a region of the active portion in contact with the inner region of the cover portion is an outer region of the active portion, 1.00&#x3c;X/X&#x2264;1.04 in which X/Xis a ratio of a molar ratio (X) of barium (Ba) to titanium (Ti) in the inner region of the cover portion to a molar ratio (X) of barium (Ba) to titanium (Ti) in the outer region of the active portion.

Multilayer ceramic electronic component

A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately disposed. Ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers. Additionally, in some examples, spaces between adjacent internal electrodes are fully occupied by the dielectric layers and the dielectric layers contain a ceramic-metal compound containing metal particle. The ceramic-metal compound layer may have an embossing type configuration or a dendrite type configuration.

Multilayer ceramic electronic component including ceramic-metal compound layers

A multilayer ceramic electronic component may include a ceramic body including an active part in which dielectric layers and internal electrodes are alternately disposed, an upper cover part disposed on the active part, and a lower cover part disposed below the active part, a buffer layer disposed in at least one of the upper and lower cover parts, and external electrodes disposed on end surfaces of the ceramic body. The buffer layer may contain a conductive metal in a content of 1 to 40 vol %.

Multilayer ceramic electronic component and board for mounting thereof

There are provided a multilayer ceramic electronic component capable of preventing problems occurring due to a difference in sintering behavior between ceramic layers and internal electrodes and having excellent reliability, and a manufacturing method thereof. The multilayer ceramic electronic component may include a ceramic body including a plurality of ceramic layers; and internal electrodes disposed in the ceramic body. The internal electrodes may contain a conductive ceramic oxide.

Multilayer ceramic electronic component and manufacturing method thereof

A multilayer ceramic electronic component may include: a ceramic body including a plurality of dielectric layers; internal electrodes disposed in the ceramic body and having one ends exposed to outer surfaces of the ceramic body; and external electrodes disposed on the outer surfaces of the ceramic body to be connected to the respective one ends of the internal electrodes and containing a conductive metal and a conductive ceramic powder.

Paste for external electrode, multilayer ceramic electronic component, and method of manufacturing the same

A multilayer ceramic electronic component may include: a ceramic body including an active part in which dielectric layers and internal electrodes are alternately disposed, an upper cover part disposed on an upper portion of the active part, and a lower cover part disposed on a lower portion thereof; a first dummy electrode disposed between a central portion of the upper or lower cover part in a length direction and one end surface of the cover part in the length direction; and a second dummy electrode disposed between the central portion of the upper or lower cover part in the length direction and the other end surface of the cover part in the length direction, and spaced apart from the first dummy electrode.

A multilayer ceramic electronic component may include: a plurality of active parts including a plurality of dielectric layers and a plurality of internal electrodes that are alternately disposed, the plurality of active parts being stacked; an interlayer margin part disposed between the active parts adjacent to each other and containing magnesium; an upper cover part disposed on an upper portion of an uppermost active part among the plurality of active parts and containing magnesium; and a lower cover part disposed on a lower portion of a lowermost active part among the plurality of active parts and containing magnesium, wherein the upper and lower cover parts and the interlayer margin part include magnesium-nickel oxide layers formed on interfaces thereof adjacent to the active parts.

Multilayer ceramic electronic component and method of manufacturing the same

There is provided a multilayer ceramic electronic component, including: a ceramic body including dielectric layers; and first and second inner electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body, the first and second inner electrodes being alternately laminated with a difference in printing widths therebetween, wherein a difference ratio between the printing widths of the first and second inner electrodes is 20 to 80%. According to embodiments of the present invention, a multilayer ceramic electronic component having excellent reliability and withstand voltage characteristics may be realized, by reducing the occurrence of cracking through a reduction in the influence of step height while securing high capacitance.

There is provided a multilayer ceramic electronic component, including: a ceramic sintered body having a plurality of dielectric layers laminated therein; first and second capacitance portions being formed on surfaces of the dielectric layers; first and second lead-out portions being respectively extended from both sides of the first and second capacitance portions to be respectively exposed through both side surfaces of the ceramic sintered body and spaced apart from each other; sealing parts enclosing both end portions and corner portions of the ceramic sintered body; and first and second external electrodes enclosing the sealing parts and formed on both end portions of the ceramic sintered body to be electrically connected to the first and second lead-out portions, respectively.

Growing community of inventors

Gyunggi-do, South Korea

Chung Eun Lee