Azurewave Technologies, Inc.

Cytoaurora Biotechnologies, Inc.

Azurewave Tehnologies, Inc.

Chung-Er Huang

Sheng-Wen Chen

Hsin-Cheng Ho

Ming-Tai Kuo

Ming Chen

Chih-Hao Liao

Chien-Yu Huang

Hei-Jen Jou

Shih-Feng Huang

Huang-Chan Chien

Yueh-Cheng Lee

Nan-Cheng Chen

Guang-Ci Ye

A contactless selection device, a light sensing structure thereof, and a biological particle selection apparatus are provided. The light sensing structure includes a substrate, an insulating layer, an electrode layer, and a photoelectric layer, the latter two of which are respectively formed on two opposite sides of the substrate. The photoelectric layer includes a plurality of collector regions, a plurality of base regions respectively formed in the collector regions, and a plurality of emitter regions that are respectively formed in the base regions. Each of the emitter regions includes a plurality of emitter pads formed in the corresponding base region. Each of the base regions, the corresponding collector region, and the corresponding emitter region are jointly formed as a vertical transistor. The insulating layer covers and separates the vertical transistors and an end of each of the emitter pads is exposed from the insulating layer.

Contactless selection device, light sensing structure thereof, and biological particle selection apparatus

A contactless selection device, a light triggering structure thereof, and a biological particle selection apparatus are provided. The light triggering structure includes a first substrate, a first electrode layer formed on the first substrate, a photodiode layer formed on the first electrode layer, and an insulating layer that covers the photodiode layer. The photodiode layer has a thickness within a range from 1 μm to 3 μm, and includes a first doped layer, an I-type layer, and a second doped layer, which are sequentially stacked from the first electrode layer. The second doped layer includes a plurality of triggering pads spaced apart from each other. Each of the triggering pads has a width within a range from 3 μm to 7 μm, and a distance between any two of the triggering pads adjacent to each other is less than or equal to 2 μm.

Contactless selection device, light triggering structure thereof, and biological particle selection apparatus

A quasi-soft catcher, a quasi-soft capture device, and a method for using the same are provided. The quasi-soft catcher includes a base and a plurality of protruding structures for capturing at least one target biological particle from a specimen. The protruding structures are regularly arranged on a board surface of the base. Each of the protruding structures includes an outer portion configured to touch the at least one target biological particle and an inner portion that is connected between the board surface and the outer portion, and a structural strength of the inner portion is less than that of the outer portion. The board surface has an interspace region arranged outside of the protruding portions, and the interspace region occupies 20-80% of the board surface.

Quasi-soft catcher, quasi-soft capture device, and method using the same

Microfluidic chip

A microfluidic device includes a lower casing and an upper casing covering the lower casing. The lower casing includes a lower base wall having a top surface and a plurality of spaced-apart columns that protrude upwards from the top surface. The upper casing includes an upper base wall. A first gap between the upper base wall and a column top surface of each of the columns is large enough to permit passage of large biological particles of a liquid sample, and a second gap between any two adjacent ones of the columns is not large enough to permit passage of the large biological particles and is large enough to permit passage of small biological particles of the liquid sample.

Microfluidic device

A catcher, a capture device, and a method for capturing at least one target biological particle are provided. The catcher includes a base and a plurality of capture arms extending from the base and spaced apart from each other. Each of the capture arms has a free end portion configured to capture a target biological particle and a supporting segment connected between the free end portion and the base. The supporting segment of each of the capture arms is arranged in a projection space defined by orthogonally projecting the free end portion along a height direction onto the base. When the target biological particle is captured by two of the capture arms that are bent and arranged adjacent to each other, a part of the target biological particle is trapped by the supporting segments of the two of the capture arms and is held.

Catcher, capture device, and method for capturing target biological particle

This invention provides a system of testing multiple RF modules. The system includes a RF signal analyzer, a RF switch, a control module, and a plurality of testing modules. The RF switch is electrically coupled to the RF signal analyzer, and operational bands of the RF switch includes operational bands of the RF modules for transmitting and receiving RF signals. The controller module controls the RF signal analyzer and the RF switch. The testing modules are electrically coupled to the controller module and controlled by the controller module. Each testing module has a memorizing unit for storing testing results for the RF modules transmitting and receiving the RF signals. The RF switch and the testing modules are used to electrically couple each RF module.

System of testing multiple RF modules and method thereof

A filtering apparatus and method for dual-band sensing circuit are disclosed. The invention features a dual-band sensing unit disposed in a filtering device that receives the signals from a sub-system with variable frequency spectrum. The signals are split up into several bands. After that, one or more frequency detecting units are used to detect the power of high-band and low-band signals, and convert the power into a voltage signal. Users can externally adjust the gain of a tunable gain amplifier for the voltage signal. Further, a comparison operation is processed by a comparator, and a signal resulted from the comparison operation is used to control the switch timing for an RF switching unit. Consequently, this like adaptive notch filter is achieved to determine the intensity of noise and thereby to turn on the high-band or low-band notch filters, so as to reduce the in-band loss.

Filtering apparatus and method for dual-band sensing circuit

A substrate module having an embedded phase-locked loop is cooperated with at least one function unit mounted thereon for forming an integrated system. The substrate module includes a base, a multi-layer structure, a built-in circuit unit, and an external circuit unit. The built-in circuit unit is integrated inside the multi-layer structure and the multi-layer structure is formed in the base. The external circuit unit is mounted on the upper surface of the base and is electrically coupled to the built-in circuit unit for jointly forming a phase-locked loop, so as to cooperate with the function unit.

Substrate module having an embedded phase-locked loop, integerated system using the same, and fabricating method thereof

A through-hole structure for a wafer level packaging includes a wafer, a RF passage penetrating through the wafer, and a through-hole structure disposed around the RF passage. The through-hole structure has three types of structure. The through hole structure includes a plurality of holes filled with metal material thereinside. On the other hand, the through hole structure can be a plurality of holes coated with a metal layer on the internal surface thereof. Alternatively, the through hole structure has both of the two above hole structure. Depending on the structure, the through hole structure performs an electric reference for preventing the RF signal from decay or interference.

Chip-level through hole structure of electronic package

An integrated circuit module with temperature compensation crystal oscillator (TCXO) applying to an electronic device comprises: one substrate having one top surface; one temperature compensation crystal oscillator (TCXO) disposed on the top surface; at least one chip disposed on the top surface; one encapsulating piece formed on the top surface for covering the TCXO and the chip. As above-described structure, TCXO is prevented from exchanging heat due to the temperature difference so that the stability of the TCXO is improved.

Integrated circuit module with temperature compensation crystal oscillator

A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.

Packaging structure of SIP and a manufacturing method thereof

A communication module with dual systems for processing a first RF signal and a second RF signal that belong to different communication systems is provided. The communication module includes a first connection port and a signal distribution circuit. The first connection port is coupled to an external circuit, and the signal distribution circuit is coupled to the first connection port and between a first system path and a second system path inside the communication module. Regardless whether the external circuit is composed by an dual-band antenna or two uni-band antenna, the signal distribution circuit controls the first RF signal transmitting along the path between the first connection port and the first system path and controls the second RF signal transmitting along the path between the path between the first connection port and the second system path.

Communication module with dual systems and method for defining operating mode thereof

A wireless receiving and transmitting device includes a casing unit, an antenna unit, a substrate unit, a projection unit and an electrical connector unit. The casing unit has a casing. The antenna unit has an antenna module fixed in the casing. The substrate unit has a circuit substrate movably disposed in the casing and electrically connected to the antenna module. The projection unit has a projection element positioned on one end of the circuit substrate. The projection element has a bottom portion selectively exposed outside the casing or hidden in the casing according to the move of the circuit substrate, and the projection element has a top portion always exposed outside the casing. The electrical connector unit has an electrical connector position on another end of the circuit substrate, and the electrical connector is selectively exposed outside the casing or hidden in the casing.

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Taipei, Taiwan

Chung-Er Huang