Taiwan Semiconductor Manufacturing Comp. Ltd.

Other

Chung Chuan Huang

Chih-Hao Chen

Che-En Tsai

Yu-Chi Lin

Cha-Hsin Chao

Yi-Tsang Hsieh

Yen-Chih Huang

Yu-Lin Chiang

Li-An Sun

A semiconductor manufacturing apparatus for performing a process is disclosed. An apparatus includes a chamber configured to receive a wafer for an etching process; a conductive focus ring disposed within the chamber and configured to focus an electric field to control an etch direction of the etching process; and an insulative cover ring disposed within the chamber, wherein the insulative cover ring is configured to modify the electric field, wherein the insulative cover ring has an inner annular insulative portion and outer annular insulative portion, and wherein a gap is defined between the inner annular insulative portion and the outer annular insulative portion.

Plasma processing apparatus and method

A method includes forming a first etch stop layer (ESL) over a conductive feature, forming a first dielectric layer on the first ESL, forming a second ESL on the first dielectric layer, forming a second dielectric layer on the second ESL, forming a trench in the second dielectric layer, forming a first opening in a bottom surface of the trench extending through the second dielectric layer, and forming a second opening in a bottom surface of the first opening. The second opening extends through the first dielectric layer and the first ESL. The second opening exposes a top surface of the conductive feature. The method further includes widening the first opening to a second width, filling the trench with a conductive material to form a conductive line, and filling the second opening and the first opening with the conductive material to form a conductive via.

Semiconductor device and method of forming thereof

A cable connecting head includes a tubular part (1) and a semi-circular protrusion part (2) which extends longitudinally from a distal end of the tubular part (1). Insertions (11) extend from the side portions of the semi-circular protrusion part (2), and a metal cord (13) extends centrally relative to the tubular part (1). The insertions (11) are adapted to engage corresponding apertures (32) in an integral circuit board (3). Two notches (12) are defined at the distal end of the tubular part (1) so as to receive an edge of the integral circuit board (3).

Cable connecting head for connecting to an integral circuit board

Socket type terminal

Growing community of inventors

Hsinchu, Taiwan

Chung Chuan Huang