Everlight Electronics Co., Ltd.

Chung-Chuan Hsieh

Yung Chieh Chen

Yi-Chun Chen

Chih-Hung Hsu

Sheng-Jia Sheu

Yi-Tsuo Wu

Chieh-Yu Kang

Chia-Hsien Chang

Ke-Hao Pan

Hao-Yu Yang

Jen-Hao Pan

Tzu-Lun Tseng

Sheng-Wei Chou

Yi-Ting Chiu

Yi-Sheng Lan

Chia-Fong Chou

Yi-Tine Chiu

The present disclosure provides an LED package structure and a method for manufacturing the LED package structure. The LED package structure includes: a chip scale package (CSP) light emitting element and a shading layer, where the CSP light emitting element includes a light emitting chip, and the light emitting chip includes an electrode group located on a bottom surface of the light emitting chip, the shading layer is disposed on a bottom surface and/or a side surface of the CSP light emitting element. An LED package structure according to the present disclosure solves a problem that the blue light leaking from the bottom surface of the LED chip interferes with the emission color of the CSP emitting device, and reduces the luminous efficiency of the emitting device.

LED package structure and method for manufacturing same

A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

Carrier, carrier leadframe, and light emitting device

A light emitting device may comprise a wing portion of an electrode exposed from the resin housing. The wing portion may be made by a single or multiple stamp cutting process. To increase the connecting region between the electrode and solder, the outer side surface of the wing portion is an uneven surface. The device may further comprise a protective plating layer and an external protective plating layer. The protective plating layer may be coated on the top surface, bottom surface and a portion of the side surface of the electrode. The external portative plating layer would be coated on the outer surface of the wing region. The light reflection of the device from top surface of the electrode portion can be maintained and the outer side surface of wing portion can be protected for improving the reliability of connection between light emitting device and outer substrate.

Carrier, carrier leadframe, and light emitting device and method for manufacturing same

A light emitting diode (LED) package structure including a leadframe, a housing, a LED chip and a light-transmissive encapsulant is provided. The leadframe has a first electrode and a second electrode separated from each other. The housing wraps the first electrode and the second electrode and includes a recess having a bottom and a sidewall. The bottom of the recess has a cover layer covering the leadframe and having an opening exposing an end of the first electrode, an end of the second electrode and a spacer disposed therebetween and connected thereto wherein the spacer, the end of the first electrode and the end of the second electrode are substantially coplanar. The LED chip is disposed in the recess and electrically connected to leadframe. The light-transmissive encapsulant is filled in the recess.

Light emitting diode package structure

A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad.

Light emitting diode package, lighting device and light emitting diode package substrate

A side view light emitting diode (LED) package structure includes a package housing, a side view LED chip and a thermal conductive member. The side view LED chip is enclosed by the package housing and an emitting direction of the side view LED chip is perpendicular to a thickness direction of a substrate. The thermal conductive member connected with the side view LED chip is disposed inside the package housing and a portion of which extends out of a dissipation opening of the package housing to be exposed so that heat of the side view LED chip is dissipated.

Side view LED package structure

A light emitting diode is provided, including an LED chip, a reflector, a lens, a circuit plate, a circuit substrate and an electrical conductivity device. The LED chip is disposed in the reflector and the lens is disposed on the reflector, covering the reflector and the LED chip. The LED chip is electrically connected to the circuit plate. The circuit plate further includes a first through hole therein and the circuit substrate further includes a second through hole therein. The electrical conductivity device passes through the first through hole and the second through hole so that the circuit plate is electrically connect to the circuit substrate. The reflector is installed between the circuit plate and the circuit substrate. The first through hole and the second through hole are not connected to the reflector.

Light emitting diode

A method of fabricating light emitting diode chips having a phosphor coating layer comprises providing a substrate having a plurality of light emitting diodes formed thereon; forming a conductive bump on at least one of the plurality of light emitting diodes; forming a phosphor coating layer over the substrate and the light emitting diodes; cutting the phosphor coating layer by a point cutter to remove an upper portion of the phosphor coating layer, so as to reduce a thickness of the phosphor coating layer and expose the conductive bump; and forming a plurality of individual light emitting diode chips having the phosphor coating layer by separating the plurality of light emitting diodes.

Method of fabricating a light emitting diode chip having phosphor coating layer

An LED package is provided. The LED package includes a leadframe having a pair of first electrodes and a pair of second electrodes, an LED chip disposed on the leadframe, and an encapsulant encapsulating a portion of the leadframe and the LED chip. The pair of first electrodes and the pair of second electrodes are electrically connected with the LED chip. The pair of first electrodes and the pair of second electrodes are located outside the encapsulant. The encapsulant has a top surface, a bottom surface, a first side surface and a second side surface opposite to the first side surface, wherein the pair of first electrodes extend from the first side surface to the bottom surface, and the pair of second electrodes extend from the second side surface to the bottom surface.

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Taipei, Taiwan

Chung-Chuan Hsieh