Hewlett-packard Development Company, L.p.

Samsung Electronics Co., Ltd.

Other

Chung Ching Yang

Krzysztof Nauka

Gary A Gibson

Zhang-Lin Zhou

Theodore I Kamins

Lihua Zhao

Storrs Townsend Hoen

Kenneth James Eldredge

Carl Philip Taussig

David Horsley

Heon Lee

Peter George Hartwell

Steven Louis Naberhuis

Xia Sheng

Marvin S Keshner

Sean Xiao-An Zhang

Sui-hing Leung

Paul P Merchant

Craig M Perlov

Steven L Neberhuis

Winston C Mitchell

A fluorene-based copolymer of formula I includes a monomeric unit that includes a fluorene group and at least one steric hindering chemical group to provide sufficient steric interaction such that the spatial conformation of the fluorene-based copolymer is substantially non-planar. The fluorene-based copolymer exhibits UV light emission.

UV light-emissive fluorene-based copolymers

The present invention is drawn to a layered organic device, and a method of forming the same. The method includes steps of applying a first solvent-containing organic layer to a substrate and removing solvent from the first solvent-containing organic layer to form a first solidified organic layer. Additional steps include applying a second solvent-containing organic layer to the first solidified organic layer and removing solvent from the second solvent-containing organic layer to form a second solidified organic layer. The first solidified organic layer can be crosslinked, which suppresses negative impact to components in the first solidified organic layer when the solvent of the second solvent-containing organic layer is deposited on the first solidified organic layer.

Layered electro-organic devices with crosslinked polymer and methods of preparing the same

A data storage device includes a conductive probe having a tip; a substrate; and a data storage medium including a layer of poled ferroelectric material. The ferroelectric layer is between the tip and the substrate.

Data storage devices including conductive probes and ferroelectric storage medium and methods of operating the same

A system and method of capturing a skin print from skin having ridges and valleys. A skin print sensor having a return/supply contact and a plurality of contact pads is provided. A finger is applied to the skin print sensor and data is stored representative of contact pads in contact with skin ridges.

Fingerprint capture

Data storage device including conductive probe and ferroelectric storage medium

An assembly for depositing material onto a substrate includes a reservoir containing the material. The reservoir also includes a nozzle through which the material is jetted and formed into droplets. The droplets travel through flight paths prior to deposition onto the substrate. The assembly includes a charging ring for inducing an electrical charge to one or more of the droplets and a plurality of deflection plates for controlling the flight paths of the droplets. In addition, the assembly also includes a droplet manipulating device configured to manipulate the droplets at least one of during the flight paths and after deposition of the droplets onto the substrate.

Assembly for material deposition

A system for delivering material onto a substrate. The system includes a jetting system having a reservoir containing the material and the reservoir includes a nozzle through which the material is expelled from the reservoir. An arcuate section is positioned between the reservoir and the nozzle. The material is configured to travel from the reservoir, through the arcuate section, and through the nozzle. The system also includes a means for applying pressure on the material contained in the reservoir, wherein the material is expelled from the reservoir through application of pressure by the means for applying pressure to thereby create a column of the material from the nozzle. A means for producing pressure modulations is located proximate the nozzle and is configured to substantially regulate formation of droplets from the column of the material. In addition, the system includes a charging ring configured to induce an electrical charge to selective ones of the droplets as they pass through the charging ring. One or more deflection plates is also included for altering a trajectory of the charged droplets.

System for delivering material onto a substrate

A microelectromechanical system includes a first wafer, a second wafer including a moveable portion, and a third wafer. The movable portion is movable between the first wafer and the third wafer. The first wafer, the second wafer, and the third wafer are bonded together.

MEMS having a three-wafer structure

An information storage unit functioning in a vacuum is provided wherein a data storage medium has an information storage area for storing and reading information thereon. An array of electron beam emitters is spaced from and in close proximity to the data storage medium for selectively directing a plurality of electron beams toward the data storage medium. Focusing optics between the array of electron beam emitters and the data storage medium focus each of the electron beams on one part of the information storage area of the data storage medium. A micro electromechanical motor associated with the data storage medium moves the data storage medium relative to the array of electron beam emitters, so that each of the emitters directs an electron beam selectively to a portion of the information storage area to read or write information therein. Electronic circuitry spaced from and in electronic communication with the array of electron beam emitters controls the operations of the array of electron beam emitters. A vacuum device in the information storage unit maintains the vacuum between the data storage medium and the array of electron beam emitters.

Packaging for storage devices using electron emissions

A selenidation reaction for bonding one or more active substrates to a base substrate is disclosed. A bonded-substrate is fabricated by forming a first multi-stacked layer of selenium and indium on a bonding surface of an active substrate and forming a second multi-stacked layer of selenium and indium on a mounting surface of a base substrate. The first and second multi-stacked layers are placed into contact with each other with substantially no pressure. Then the active substrate and the base substrate are bonded to each other by annealing them in an inert ambient to form an indium-selenium compound bond layer that adhesively bonds the substrates to each other. The annealing can occur at a lower temperature than prior wafer-bonding processes and the first and second multi-stacked layers can be deposited over a wide range of relatively low temperatures including room temperature. Additionally, tellurium can be added to the selenium of either one or both of the first and second multi-stacked layers to reduce the annealing temperature and to form an indium-selenium-tellurium compound bond layer that adhesively bonds the substrates to each other. Elemental compounds or amorphous compounds can be used for the materials of the first and second multi-stacked layers to form a polycrystalline or amorphous compound bond layer respectively. One advantage of the compound bond layer is that it can be dissolved using a selective wet etching material so that the active substrate and the base substrate can be non-destructively detached from each other.

Substrate bonding using a selenidation reaction

A storage device including many field emitters in close proximity to a storage medium, and a micromover, all in a partial vacuum. Each field emitter can generate an electron beam current. The storage medium has many storage areas on it, with each field emitter responsible for a number of storage areas. Also, each storage area can be in a number of different states to represent the information stored in that area. In storing information to the storage device, the power density of an electron beam current is increased to change the state of the storage area bombarded by the electron beam current. In reading information from the device, the power density of the electron beam current is reduced to generate a signal current from the storage area bombarded by the electron beam current. During reading, the power density is selected to be low enough so that no writing occurs. The magnitude of the signal current depends on the states of the storage area. The information stored in the storage area is read by measuring the magnitudes of the signal current. Finally, the micromover can scan the storage medium with respect to the field emitters so that each field emitter can access many storage areas.

Growing community of inventors

Saratoga, CA, United States of America

Chung Ching Yang