Taiwan Semiconductor Manufacturing Comp. Ltd.

Chung-Chih Chen

Chih-Hao Lin

Chien-Kuo Chang

Tzu-Kai Lan

Jr-Lin Hsu

Hsien-Liang Meng

Ying-Shin Han

Yen-Miao Lin

A semiconductor package is provided, including a package component and a number of conductive features. The package component has a non-planar surface. The conductive features are formed on the non-planar surface of the package component. The conductive features include a first conductive feature and a second conductive feature respectively arranged in a first position and a second position of the non-planar surface. The height of the first position is less than the height of the second position, and the size of the first conductive feature is smaller than the size of the second conductive feature.

Semiconductor package having varying conductive pad sizes

A semiconductor package is provided, including a package component and a number of conductive connectors. The package component has a number of conductive features on a surface of the package component. The conductive connectors are formed on the conductive features of the package component. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.

A method of forming a semiconductor package includes dispensing an adhesive on a substrate that has an integrated circuit die attached thereon, placing a lid over the integrated circuit die such that a bottom surface of the lid caps at least a portion of the adhesive, and pressing the lid against the substrate such that a portion of the adhesive is squeezed from a space between the bottom surface of the lid and the substrate onto a sidewall of the lid.

Method of forming a semiconductor package

A semiconductor package is provided, including a package substrate, a package component, and a number of conductive connectors. The package component has a number of conductive features on a first surface of the package component facing the package substrate. The conductive connectors electrically connect the conductive features of the package component to the package substrate. The conductive features include a first conductive feature and a second conductive feature contacting a first conductive connector and a second conductive connector, respectively. The size of the first conductive feature is smaller than the size of the second conductive feature, and the height of the first conductive connector on the first conductive feature is greater than the height of the second conductive connector on the second conductive feature.

A semiconductor package includes a substrate, an integrated circuit die, a lid and an adhesive. The integrated circuit die is disposed over the substrate. The lid is disposed over the substrate. The lid includes a cap portion and a foot portion extending from a bottom surface of the cap portion. The cap portion and the foot portion define a recess, and the integrated circuit die is accommodated in the recess. The adhesive includes a sidewall portion and a bottom portion. The sidewall portion contacts a sidewall of the foot portion. The bottom portion extends from the sidewall portion to between a bottom surface of the foot portion and the substrate.

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Hsinchu, Taiwan

Chung-Chih Chen