Nan Ya Plastics Corporation

Chung-Chi Su

Te-Chao Liao

Sen-Huang Hsu

Jung-Jen Chuang

Chuan Chou

Jui-Jung Lin

Chun-Che Tsao

Zhang-Jian Huang

Chia-Sheng Lai

Cheng-Li Chao

Hsiao-Loung Lu

Chi-Ming Chang

A method for processing a waste fabric containing polyester and wool fibers includes the following steps. The method is to treat the waste fabric with an acid catalyst aqueous solution at 160° C. to 170° C. The wool fibers are degraded and completely separated from the polyester fibers in a treatment process. Afterwards, the polyester fibers are recycled.

Method for processing waste fabric containing polyester and wool fibers

A method for processing a waste fabric containing polyester and cotton fibers includes the following steps. The first step is providing a plurality of fabric scraps each containing polyester fibers and cotton fibers. The next step is allowing an acid catalyst aqueous solution to repeatedly contact and react with the fabric scraps at 130° C. to 160° C. in a circulation and backflow manner, so as to separate the cotton fibers from each of the fabric scraps. The last step is recycling the reacted acid catalyst aqueous solution and fabric scraps.

Method for processing waste fabric containing polyester and cotton fibers

An unsaturated polyester resin composition with low styrene volatility and a molding article thereof are provided. The unsaturated polyester resin composition of includes: 30 to 60 parts by weight of unsaturated polyester resin and 2 to 30 parts by weight of comonomer, and the comonomer includes: (a) methyl styrene, (b) hydroxy acrylate monomer and (c) diallyl phthalate monomer, and the weight ratio of the content (a), (b), and (c) is 6:3:1 in the comonomer.

Unsaturated polyester resin composition and molded article thereof

A curing agent composition and a curing agent coating formula thereof are provided. The curing agent composition includes 5 to 25 wt % of an ester group-containing amine end group adduct, 2 to 25 wt % of a C8-C22 hydrophobic saturated or unsaturated fatty amine, 2 to 25 wt % of a polyamine compound, 2 to 20 wt % of a silane compound, and 10 to 60 wt % of an ether solvent.

Curing agent composition and curing agent coating formula thereof

A curing agent and method for producing the same are provided, the method includes: esterification reaction: reacting a polyhydric alcohol with a polybasic acid anhydride to obtain an ester-based emulsifier (A); chain extension reaction: reacting an ester-based emulsifier (A) with a bifunctional epoxy resin to obtain a polymer intermediate (B); and reacting the polymer intermediate (B) with a polyamine compound to obtain a curing agent (C).

Curing agent and method for manufacturing the same

A recycled polyester fiber is provided. The recycled polyester fiber is made of a raw material by melt spinning. The raw material includes 95.0 wt % to 99.99 wt % recycled polyester pellet formed from recycled bottle chip and 0.01 wt % to 5.0 wt % titanium dioxide slurry. Based on the total weight of the titanium dioxide slurry, the titanium dioxide slurry includes 20 wt % to 50 wt % bio-oil acting as carrier, 50 wt % to 80 wt % titanium dioxide powder, 0.1 wt % to 5 wt % dispersant, 0.01 wt % to 3 wt % antioxidant, and 0.001 wt % to 0.1 wt % dye.

Recycled polyester fiber

Provided is a novel photosensitive resistive ink composition, comprising: (A) a photo curable prepolymer containing at least two ethylenically unsaturated bonds with an a,&bgr;-unsaturated carboxylic acid, represented by the formula I, (B) a photocurable monomer containing at least three vinyl groups and an a,&bgr;-unsaturated carboxylic acid, (C) a photo-initiator, (D) organic solvents, (E) an epoxy compound containing at least one vinyl group and one epoxy group in the molecule unit, (F) a curing agent capable of allowing a photocurable prepolymer (A) undergo a thermal reaction, and (G) a clay nano-composite capable of increasing the surface area of inorganic materials of the photosensitive resistive ink composition. The composition produces a solder mask film having a desired pattern after coating, exposure, development and postcuring and excellent in adhesiveness, resistance to chemicals, resistance to insulatiion, resistance to heat, developability, pot life, resistance to electroless gold plating, transparency of the photo-resist film and resolution.

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Taipei, Taiwan

Chung-Chi Su