Taiwan Semiconductor Manufacturing Comp. Ltd.

Chung Chi Ko

Tien-I Bao

Yung-Cheng Lu

Tsu Shih

Syun Ming Jang

Lih Ping Li

A method comprises forming a low-dielectric constant (low-k) layer over a semiconductor substrate, forming an anti-reflective layer over the low-k layer, forming at least one opening in the anti-reflective layer and in the low-k layer, forming a nitrogen-free liner in the at least one opening, and forming at least one recess through the nitrogen-free liner, the anti-reflective layer, and at least partially into the low-k layer, the at least one recess is disposed over the at least one opening.

Method of preventing photoresist poisoning of a low-dielectric-constant insulator

A method for forming a protective oxide liner to reduce a surface reflectance including providing a hydrophilic insulating layer over a conductive layer; providing an anti-reflectance coating (ARC) layer over the hydrophilic insulating layer; providing an etching stop layer over the anti-reflectance coating (ARC) layer; photolithographically defining a pattern on a surface of the etching stop layer for etching; anisotropically etching at least one etch opening extending at least partially through a thickness of the hydrophilic insulating layer; depositing an oxide liner such that the sidewalls and bottom portion of the at least one etch opening and said surface are covered by the oxide liner; and, removing the oxide liner from aid surface according to a chemical mechanical (CMP) process to a surface reflectance.

Growing community of inventors

Nantou, Taiwan

Chung Chi Ko