Taiwan Semiconductor Manufacturing Comp. Ltd.

Chung-Cheng Chou

Yu-Der Chih

Zheng-Jun Lin

Pei-Ling Tseng

Po-Hao Lee

Wen-Ting Chu

Chien-An Lai

Chin-I Su

Hank Cheng

Tien-Yen Wang

Ming-Zhang Kuo

Jonathan Tsung-Yung Chang

Chiting Cheng

Yi-Chun Shih

Chien-Hua Huang

Yi-Tzu Chen

Hsu-Shun Chen

Jonathan Tehan Chen

Shih-Lien Linus Lu

Yue-Der Chih

Chia-Fu Lee

Chi-Lin Liu

Chen-Hui Hsieh

Hung-Jen Liao

Cheng Hung Lee

Tien-Wei Chiang

Subramani Kengeri

Ya-Chen Kao

Tong-Chern Ong

Bharath Upputuri

Hsueh-Chih Yang

Chien-Kuo Su

Bin-Hau Lo

Pey-Huey Chen

Kuo-Chi Tu

Jack Liu

Ching-Wei Wu

Hau-Tai Shieh

Yangsyu Lin

Chia-Wei Su

Cheng-Hung Lee

Wei-Jer Hsieh

Chen-Ming Hung

Ping-Lin Yang

Hsin-Hsin Ko

Tsung-yung Jonathan Chang

Tsai-Hsin Lai

Hsiao Wen Lu

Ruei-Chin Luo

PoHao Lee

Hsiao-Wen Lu

Hsiu-Feng Peng

Chien-Hua Chuang

Chun-Yun Wu

A memory device includes an array of resistive memory cells with a plurality of word lines connected to the array of resistive memory cells. A voltage compensation controller is configured to determine a word line voltage to be applied to a selected word line of the plurality of word lines. A word line driver is configured apply the determined word line voltage to the selected word line.

RRAM voltage compensation

A memory device includes RRAM memory cells configured to form a zero-transistor and one-resistor (0T1R) array structure in which access transistors of the RRAM memory cells are bypassed or removed. Alternatively, the access transistors of the RRAM memory cells may be arranged in a parallel structure to reduce associated IR drop and thus enable reduced write voltage operation.

Resistive memory with low voltage operation

A memory architecture includes: a plurality of cell arrays each of which comprises a plurality of bit cells, wherein each of bit cells of the plurality of cell arrays uses a respective variable resistance dielectric layer to transition between first and second logic states; and a control logic circuit, coupled to the plurality of cell arrays, and configured to cause a first information bit to be written into respective bit cells of a pair of cell arrays as an original logic state of the first information bit and a logically complementary logic state of the first information bit, wherein the respective variable resistance dielectric layers are formed by using a same recipe of deposition equipment and have different diameters.

Resistive random access memory device

A memory circuit includes a bias voltage generator including a first node, a current source coupled between a first power supply node and the first node, and a first transistor and a first resistive device coupled in series between the first node and a power reference node. A drive circuit includes a second node, an amplifier including a first input terminal coupled to the first node and a second input terminal coupled to the second node, and a second transistor coupled between a second power supply node and the second node and including a gate coupled to an output terminal of the amplifier, and a resistive random-access memory (RRAM) device is coupled between the second node and the power reference node.

RRAM circuit and method

A resistive random-access memory (RRAM) circuit includes a current source configured to output a first current, a first n-type transistor including a first drain terminal configured to receive the first current, an RRAM device, second and third n-type transistors including respective second and third drain terminals coupled to an output terminal of the RRAM device, an amplifier including a non-inverting input coupled to the first drain terminal, an inverting input configured to receive a first reference voltage level, and an output coupled to a gate of each of the first through third n-type transistors, a fourth n-type transistor coupled between the second n-type transistor and a power supply reference node, and a comparator including a non-inverting input configured to receive a second reference voltage level, an inverting input coupled to each of the second and third drain terminals, and an output coupled to a gate of the fourth n-type transistor.

RRAM circuit

A memory device includes a memory cell and a sense amplifier. The sense amplifier has a reference circuit configured to output a reference voltage and a sensing circuit connected to the memory cell. A comparator includes a first input and a second input, with the first input connected to the reference circuit to receive the reference voltage, and the second input connected to the memory cell. A precharger is configured to selectively precharge the sensing circuit to a predetermined precharge voltage.

Memory sense amplifier with precharge

A semiconductor device includes an error correction code circuit and a register circuit. The error correction code circuit is configured to generate first data according to second data. The register circuit is configured to generate reset information according to a difference between the first data and the second data, for adjusting a memory cell associated with the second data. A method is also disclosed herein.

Semiconductor device and operation method thereof

A voltage regulator circuit is provided. The voltage regulator circuit includes a voltage regulator configured to provide an output voltage at an output terminal. A plurality of macros are connectable at a plurality of connection nodes of a connector connected to the output terminal of the voltage regulator. A feedback circuit having a plurality of feedback loops is connectable to the plurality of connection nodes. The feedback loop of the plurality of feedback loops, when connected to a connection node of the plurality of connection nodes, is configured to provide an instantaneous voltage of the connection node as a feedback to the voltage regulator. The voltage regulator is configured, in response to the instantaneous voltage, regulate the output voltage to maintain the instantaneous voltage of the connection node approximately equal to a reference voltage.

Low-dropout (LDO) regulator with a feedback circuit

In some aspects of the present disclosure, a memory device is disclosed. In some aspects, the memory device includes a first voltage regulator to receive a word line voltage provided to a memory array; a resistor network coupled to the first voltage regulator to provide an inhibit voltage to the memory array, wherein the resistor network comprises a plurality of resistors and wherein each of the resistors are coupled in series to an adjacent one of the plurality of resistors; and a switch network comprising a plurality of switches, wherein each of the switches are coupled to a corresponding one of the plurality of resistors and to the memory array via a second voltage regulator.

Dynamic inhibit voltage to reduce write power for random-access memory

A memory circuit includes a first driver circuit, a memory cell array including a first column of memory cells, a first transistor coupled between the first driver circuit and the memory cell array, a second driver circuit, a first column of tracking cells and a header circuit coupled to the first driver circuit and the second driver circuit. The first transistor is configured to receive a first select signal. The first column of tracking cells is configured to track a leakage current of the first column of memory cells, and is coupled between a first conductive line and a second conductive line, the first conductive line being coupled to the second driver circuit.

Memory cell array circuit and method of forming the same

A system includes a charge pump system having a plurality of enable signal input terminals and an output terminal, the charge pump system configured to provide an output voltage at the output terminal; and a detection circuit connected to the enable terminals and the output terminal of the charge pump system, the detection circuit configured to compare the charge pump system output voltage to a plurality of predefined input detection voltage levels, and to selectively output a plurality of enable signals to the charge pump system enable signal input terminals in response to the comparison.

Charge pump system with low ripple output voltage

A method of operating a memory circuit includes generating a first current in response to a first voltage. The first current includes a first set of leakage currents and a first write current. The method further includes generating, by a tracking circuit, a second set of leakage currents configured to track the first set of leakage currents of the first column of memory cells, and mirroring the first current in a first path with a second current in a second path by a first current mirror. The second current includes the second set of leakage currents and a second write current. The first write current corresponds to the second write current. The first set of leakage currents corresponds to the second set of leakage currents.

A memory device including a static random-access memory that includes two cross-coupled inverters and an access transistor having a gate connected to a word line. The memory device further includes one or more logic gates electrically coupled to the static random-access memory, and a non-volatile memory electrically coupled to the static random-access memory and configured to store data and be read using the static random-access memory, wherein the non-volatile memory is connected on one side to the access transistor and on another side to the two cross-coupled inverters.

Non-volatile memory based compute-in-memory cell

A memory circuit includes a bias voltage generator including a bias voltage node, an activation voltage generator including a resistive device, and a first amplifier, a drive circuit including a second amplifier including an input terminal coupled to the bias voltage node, and a resistive random-access memory (RRAM) array. The activation voltage generator and the first amplifier are configured to generate a portion of a bias voltage level on the bias voltage node based on a resistance of the resistive device, and the drive circuit is configured to output a drive voltage having the bias voltage level to the RRAM array.

Growing community of inventors

Hsin-Chu, Taiwan

Chung-Cheng Chou