Au Optronics Corporation

Chung-Chan Liu

Pin-Miao Liu

Yi-Cheng Liu

Chung Peng

Ho-Cheng Lee

Hui-Ku Chang

Sheng-Kai Lin

Chien-Cheng Chang

A display device includes a circuit substrate, a blocker, a first and second pad located on the circuit substrate, a light-emitting element, and a first and second connecting portion. The blocker is located on the circuit substrate, and has an opposite first and second side and an opposite third and fourth side. The first pad is adjacent to the first side of the blocker. The second pad is adjacent to the second side of the blocker. The light-emitting element is located on the blocker and the first and second pads, and includes a first and second electrode. The first connecting portion is connected to the first electrode and the first pad. The second connecting portion is connected to the second electrode and the second pad. The third and fourth sides of the blocker are aligned with a side of each of the first and second connecting portions.

Display device

A display apparatus includes a driving substrate and a first light emitting diode element. The driving substrate has a plurality of driving structures. Each of the driving structures includes a first pad, a second pad, a third pad and a fourth pad. The plurality of driving structures include a first driving structure. The first light emitting diode element is electrically connected to a first pad and a second pad of the first driving structure, and the first light emitting diode element crosses a line connecting a third pad and a fourth pad of the first driving structure. A manufacturing method of the display apparatus is also provided.

Display apparatus and manufacturing method thereof

A display apparatus includes a driving substrate, a first light-emitting diode element, a first connection element, a second connection element, a first insulation pattern, and a reflective pattern. The driving substrate has a first pad, a second pad, a third pad, and a connection area. The first connection element is electrically connected to a first electrode of the first light-emitting diode element and the first pad of the driving substrate. The second connection element is electrically connected to a second electrode of the first light-emitting diode element and the second pad of the driving substrate. The first insulation pattern is disposed on the first light-emitting diode element, the first connection element, and the second connection element. The reflective pattern is disposed on the first insulation pattern.

Display apparatus

A light-emitting apparatus including a circuit substrate and a light-emitting device is provided. The circuit substrate includes a first electrode and a second electrode. The light-emitting device is disposed on a first surface of the circuit substrate. The light-emitting device includes a first conductive terminal and a second conductive terminal. The first conductive terminal and the second conductive terminal are embedded between the first electrode and the second electrode. In a first direction, there is a first distance between an inner edge of the first electrode and an inner edge of the second electrode, there is a second distance between an outer edge of the first conductive terminal and an outer edge of the second conductive terminal, and the first distance is greater than or equal to the second distance.

Light-emitting apparatus and manufacturing method thereof

A display panel including an array substrate, a first sub-pixel, a second sub-pixel, and a first light-emitting diode is provided. The array substrate includes a first connection pad and a second connection pad. The first sub-pixel includes a first driving unit electrically connected to the first connection pad. The second sub-pixel includes a second driving unit electrically connected to the second connection pad. The first light-emitting diode completely overlaps and is physically isolated from the second connection pad. The first light-emitting diode is not completely overlapped and is electrically connected to the first connection pad. A manufacturing method of a display panel is also provided.

Display panel and manufacturing method thereof

A self-emissive element includes a light-emitting diode (LED) and an auxiliary structure. The LED includes a first type semiconductor, a second type semiconductor, a first pad, and a second pad. The second type semiconductor is overlapped with the first type semiconductor in a vertical direction perpendicular. The auxiliary structure includes a cover portion, a protection portion and a first anchor portion. The cover portion is overlapped with the LED in the vertical direction. The protection portion is not overlapped with the LED in the vertical direction. An orthographic projection area of the protection portion in the vertical direction is greater than or equal to an orthographic projection area of the LED in the vertical direction. The first anchor portion and the protection portion are respectively located at different sides of the LED.

Self-emissive element and manufacturing method of light emitting apparatus

An electronic component includes a circuit substrate, a connecting electrode, a micro-element, and a solder. The connecting electrode is located on the circuit substrate. The connecting electrode has a first transparent conductive layer. A surface of the first transparent conductive layer is located opposite the circuit substrate, and has a plurality of micrometers or nanometer particles. The micro-element is electrically connected to the connecting electrode. The solder is located between the connecting electrode and the micro-element, and fixes the micro-element on the connecting electrode.

Method for fabricating the electronic component, and method for transposing a micro-element

The present disclosure provides a display device including a first display panel, a second display panel, at least one detection device, and a control module. The first display panel includes a first display area having first sub-pixel regions, the second display panel includes a second display area having second sub-pixel regions, and the second display panel is movable to at least partially overlap the first display panel. The detection device is disposed on at least one of the first and second display panels to detect a position of the other one and generate a relative position detection signal correspondingly. The control module is electrically connected to the detection device to receive the relative position detection signal and an image display signal from an image signal source, so as to generate a first display signal and a second display signal to respectively output to the first and second display panels.

A light emitting diode panel including a first connecting wire, a first driving connection wire, a second driving connection wire, a first light emitting device, a second light emitting device and a spare electrode is provided. The driving signal transmitted by the first driving connection wire is independent of the driving signal transmitted by the second driving connection wire. The first light emitting device is connected to the first connecting wire and the first driving connection wire. The second light emitting device is connected to the first connecting wire and the second driving connection wire. The spare electrode is positioned between the first driving connection wire and the second driving connection wire. The spare electrode includes a first part and two second parts. The first part is positioned between two second parts. The first part extends in a first direction and each of the second parts extends in a second direction. An imaginary line extending from the first part along the first direction crosses over two second parts.

Light emitting diode panel

An electronic component includes a circuit substrate, a connecting electrode, a micro-element, and a solder. The connecting electrode is located on the circuit substrate. The connecting electrode has a first transparent conductive layer. A surface of the first transparent conductive layer is located opposite the circuit substrate, and has a plurality of micrometer or nanometer particles. The micro-element is electrically connected to the connecting electrode. The solder is located between the connecting electrode and the micro-element, and fixes the micro-element on the connecting electrode.

Growing community of inventors

Hsin-Chu, Taiwan

Chung-Chan Liu