Henkel Ag & Company, Kgaa

Henkel IP Holding Gmbh

Chunfu Chen

Chao Wang

Daoqiang Lu

Bin Li

Hongyu Wang

Junichi Sawanobori

Masao Kanari

Xin Wang

Leo Hao Li

Victor Xinya Lu

AiFu Che

Yinxiao Yuan

Shuichi Iwasaki

Minrui Li

Junichi Sawabobori

The present invention is directed to an one component (1K) composition comprising: The one component composition finds particular utility as a structural adhesive.

One component (1K) composition based on modified epoxy resin

The present invention is directed to an one-component (1K) composition comprising, based on the weight of the composition:

One component (1K) composition based on epoxy resin

The present invention is directed to a two component (2K) composition comprising:

Two component (2K) composition based on modified epoxy resin

This invention relates to a two-part epoxy based composition, comprising a first part comprising at least one epoxy resin; a second part comprising at least one epoxy resin curing agent, and at least one acrylamide compound containing a hydrogen atom bound to the nitrogen atom in the acrylamide structure. The two-part epoxy based composition according to the present invention exhibits excellent adhesion strength to low surface tension substrates, such as stainless steel and PVC.

Two-part epoxy based composition

The present invention relates to a photo-curable liquid optically clear adhesive composition, to a cured adhesive and an article produced therefrom, and to the use thereof.

Photo-curable liquid optically clear adhesive composition and the use thereof

This invention relates to an epoxy based composition, comprising at least one epoxidized unsaturated polyolefin; at least one thiol compound; and at least one curing catalyst. The epoxy based composition according to the present invention exhibits fast curing property under UV light and has improved adhesion strength after being further heated.

Epoxy based composition

The present invention provides a photo-curable adhesive composition for display panel assembly comprising a) at least one polyurethane acrylate having Tg value from &#x2212;70 to 20&#xb0; C.; b) at least one (meth)acrylate monomer; c) at least one chain transfer agent; d) at least two thixotropy agents, wherein first thixotropy agent is selected from the group consisting of hydrophobic fumed silica, hydrophilic fumed silica and mixtures thereof and second thixotropy agent is selected from the group consisting of modified urea, polyhydroxycarboxylic acid esters and mixtures thereof; e) at least one photoinitiator; f) at least one plasticizer; and g) at least one defoamer. The photo-curable adhesive composition according to the present invention can be used in bonding two transparent substrates together or in bonding one transparent substrate and one opaque substrate together. Furthermore, the composition according to the present invention can be used in a process of making an optical assembly.

Photo-curable adhesive composition, preparation and use thereof

The present application relates to a resin composition and in particular to a light-curable resin composition. It is known to achieve a thixotropic behavior of an adhesive composition by adding an inorganic additive like fumed silica. Adding inorganic additives results in significant particle problems as fumed silica is a solid particle and affects the optical performance of the adhesive composition. In accordance with the invention a particle free resin composition with a thixotropic behavior is provided. The inventive composition comprises a) 30 to 90 wt % of a urethane acrylate oligomer with a molecular weight greater than 15000, b) 2 to 40 wt % of a (meth)acrylate monomer having a benzene ring, and c) 0.2 to 10 wt % of a photo initiator.

Growing community of inventors

Kawasaki, Japan

Chunfu Chen