Honeywell International Inc.

Northrop Grumman Systems Corporation

University of Minnesota

Chunbo Zhang

Steven J Eickhoff

Wei Yang

Alex Gu

Dah-Weih Duan

Elizabeth Twyford Kunkee

J David Zook

Brian C Krafthefer

Yuandong Gu

Gershon Akerling

Martin Kristoffersen

Haiyang Liu

Ming-Jong Shiau

Patty P Chang-Chien

William Roland Deal

Dino Ferizovic

Daniel R Scherrer

Kelly Jill Hennig

Kevin M Leong

Steve Swanson

Francis A Kulacki

Greta S Tsai

Peter Ngo

Patrick S Gonia

Phuong Nguyen

Xianglin Zeng

Victor J Watson

Martin E Roden

Maria L Tenorio

Martn E Roden

An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. A top enclosure encloses the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the top enclosure engage reference ground metal traces on respective surface of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.

RF circuit and enclosure having a micromachined interior using semiconductor fabrication

An exemplary semiconductor technology implemented microwave filter includes a dielectric substrate with metal traces on one surface that function as frequency selective circuits and reference ground. Other metal traces on the other surface of the substrate also provide reference ground. Bottom and top enclosures that enclose the substrate have respective interior recesses with deposited continuous metal coatings. A plurality of metal bonding bumps or bonding wall extends outwardly from the projecting walls of the bottom and top enclosures. The bonding bumps on the bottom and top enclosures engage reference ground metal traces on respective surfaces of the substrate. As a result of applied pressure, the bonding bumps and respective reference ground metal traces together with the through-substrate vias form a metal-to-metal singly-connected ground reference structure for the entire circuitry.

Filter with an enclosure having a micromachined interior using semiconductor fabrication

A press including a passive load leveler for bonding integrated circuit wafers, chips or substrates. The press includes a press frame, a press ram moveable relative to the frame, a first platen coupled to the press ram, and a second platen coupled to the press frame. The load leveler is coupled between the press frame and the second platen, and includes a main body having a first surface coupled to the press frame a plurality of pistons extending from the main body through a second surface and being in contact with the second platen. Each of the pistons is positioned within a piston chamber that is in fluid communication with a network of channels within the main body, where the pistons move relative to each other through a working fluid within the channels so as to maintain the first and second platens parallel to each other under the ram pressure.

Passive hydraulic load leveler for thermal compression bonding

A sensor assembly for determining whether a hermetically sealed cavity between opposing substrate wafers in a wafer level packaged (WLP) chip is leaking. The sensor assembly includes a thermal insulating layer provided within the cavity, and a heater and temperature sensor deposited on the insulation layer. The thermal insulating layer is made of a suitable dielectric that is compatible with WLP and MMIC fabrication processes and can be, for example, benzocyclobutene (BCB) or polyimide. The sensor is responsive to a current that heats the thermal insulation layer so that heat dissipated by the thermal insulation layer is drawn away by gas between the layer and the substrate that determines the temperature of the sensor, which is detected.

Micro hermetic sensor

A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.

Waveguide and semiconductor packaging

A system includes at least one active energy transfer coil and a first passive energy transfer coil. The active energy transfer coil is configured to couple with a power supply. The at least one active energy transfer coil has an active coupling range. The first passive energy transfer coil is magnetically coupled to the active energy transfer coil and is located within the active coupling range. The first passive energy transfer coil has a passive coupling range. The first passive energy transfer coil is configured to provide energy to a first device located within the passive coupling range and based on energy received from the at least one active energy transfer coil.

Wireless energy transfer

Improved portable power sources such as batteries, fuel cells, power generators and the like can include structure or apparatus that are adapted to provide an indication of the power capacity remaining within the portable power source. In some cases, these power sources may be configured to accommodate remote communication regarding their remaining power capacity.

Power generation capacity indicator

A power generator includes a hydrogen generator that generates hydrogen in response to water vapor. A solid oxide fuel cell is coupled to the hydrogen generator for receiving hydrogen and is coupled to a source of oxygen.

Solid oxide fuel cell

An oscillator apparatus and method for vibration energy harvesting includes a nonlinear oscillator (e.g. piezoelectric, magnetic or liquid oscillator) configured in association with a potential energy profile to enhance a desirable nonlinear effect with a larger displacement and a wider spectrum response. A cantilever beam associated with a vibrating structure generates a mechanical energy in response to vibration forces. A mechanical-to-electrical power converter can be coupled to the nonlinear oscillator to convert the mechanical power into an electrical power. The frequency response of the nonlinear oscillator adapts to varying ambient vibrations and auto-tunes with respect to the ambient vibration change for wireless and MEMS applications.

Nonlinear oscillator for vibration energy harvesting

A blowerless heat exchanger apparatus based on micro-jet entrainment is disclosed. The heat exchanger apparatus incorporates a number of fins regularly spaced apart from each other and parallel to each other, thus letting air currents flow in the space defined between them. A dense array of micro-jet nozzles can be fabricated on the fins surface pointing to the flow direction of the air movement in order to induce increase airflow. The air from an air compressor delivers sufficient airflow on the fins surface utilizing micro-jets entrainment. The micro-jet entrainment confirms strong turbulent around the micro-jets and suggests significant heat transfer enhancement. The turbulence from the micro-jets enhance the heat transfer coefficient, potentially by an order of magnitude, therefore allowing much larger fin spacing and leads to huge reduction of flow resistance and overall power consumption.

Blowerless heat exchanger based on micro-jet entrainment

A fuel source for an electrochemical cell includes two or more chemical hydride pellets, a flexible, porous, liquid water impermeable, hydrogen and water vapor permeable membrane in contact with and at least partially surrounding each hydride pellet, and a porous metal hydride layer positioned between each hydride pellet. Air gaps are between each pellet.

Fuel source for electrochemical cell

The electronic system includes an electronic device and a liquid holding section that is thermally coupled to the electronic device. The electronic system further includes an impermeable section that engages the liquid holding section. The impermeable section includes a channel and a plurality of passages that provide fluid communication between the liquid holding section and the channel. The electronic system further includes (i) a first fluid that flows through the channel in the impermeable section to facilitate heat transfer from the electronic device to the first fluid; and (ii) a second fluid that flows from the liquid holding section through the plurality of passages into the channel when the second fluid boils within the liquid holding section due to heat transfer from the electronic device to the second fluid. In some embodiments, the first and second fluids are different types of substances.

Growing community of inventors

Plymouth, MN, United States of America

Chunbo Zhang