Novatek Microelectronics Corp.

Fitipower Integrated Technology, Inc.

Chun-Yung Cho

Ju-Lin Huang

Jhih-Siou Cheng

Chieh-An Lin

Cheng-Hung Chen

Chia-En Wu

Keko-Chun Liang

Tzu-Chiang Lin

Po-Yu Tseng

Yu-Shao Liu

Bo-Wen Huang

Che-Lun Hsu

Mao-Cheng Chiu

Li-Wei Liu

A source driving circuit of a display includes a gamma resistor strings, a digital to analog (DAC) circuit, and an output buffer circuit. The output buffer circuit includes input stage module, gain stage module, and output stage module. The input stage module includes main input stage unit and auxiliary input stage unit. Sizes of elements in main input stage unit are larger than sizes of elements in the auxiliary input stage unit, smaller sizes presenting smaller parasitic capacitances. During the switching period, the auxiliary input stage unit, gain stage module, and output stage module form a first unity gain amplifier outputting the driving voltages. During the stable period, the main input stage unit, gain stage module, and output stage module form a second unity gain amplifier outputting the driving voltages. A display device is also disclosed.

Source driving circuit for improving gamma voltage response time and display device

A chip-on-film package including a flexible substrate, first test pads, second test pads, first connecting wires, second connecting wires and a chip is provided. The flexible substrate includes at least one segment. Each segment has a central portion and a first side portion and a second side portion located at two opposite sides of the central portion. The chip disposed on the central portion includes first connecting pads and second connecting pads. The first test pads and the second test pads are disposed on the first side portion. Two ends of each of the first connecting wires are connected to the corresponding first connecting pad and the corresponding first test pad. Two ends of each of the second connecting wires are connected to the corresponding second connecting pad and the corresponding second test pad. Each of the second connecting wires includes a first section located at the second side portion.

Chip-on-film package

A buffer circuit, a display module, and a display driving method are disclosed. The buffer circuit comprises a first polarity buffer, a negative polarity buffer. The first polarity buffer receives a first supply voltage and a second supply voltage to output a first reference voltage to a first resistance string. The second supply voltage is less than the first supply voltage. The negative polarity buffer receives the second supply voltage and a third supply voltage to output a negative reference voltage to a negative resistance string. The third supply voltage is less than the second supply voltage.

Buffer circuit, panel module, and display driving method

An output stage circuit includes: a first transistor, including a first terminal coupled to a first node, a second terminal coupled to an output terminal, a third terminal coupled to an input terminal for receiving an input voltage, and a fourth terminal coupled to a first power terminal for receiving a first voltage; a second transistor, including a first terminal coupled to a second node, a second terminal coupled to the output terminal, a third terminal coupled to the input terminal for receiving the input voltage, and a fourth terminal coupled to ground; and a current source, coupled to the output terminal for providing a constant current.

Output stage circuit

A buffer circuit, a display module, and a display driving method are disclosed. The buffer circuit comprises a positive polarity buffer, a negative polarity buffer. The positive polarity buffer receives a first supply voltage and a second supply voltage to output a positive reference voltage to a positive resistance string. The second supply voltage is less than the first supply voltage. The negative polarity buffer receives the second supply voltage and a third supply voltage to output a negative reference voltage to a negative resistance string. The third supply voltage is less than the second supply voltage.

A panel driver integrated circuit (IC) and a cooling method of the panel driver IC are provided. The panel driver IC includes a data encoder, a level shifter, a Digital-to-Analog Converter (DAC), a rearrangement circuit and an output buffer. The data encoder receives and selectively changes an original data for outputting to the level shifter. An input terminal and an output terminal of the level shifter are coupled to an output terminal of the data encoder and a data input terminal of the DAC, respectively. The output terminals of the rearrangement circuit are respectively coupled to the reference voltage input terminals of the DAC for providing different reference voltages. The rearrangement circuit correspondingly rearranges the order of the reference voltages according to the operation of the data encoder. An input terminal of the output buffer is coupled to an output terminal of the DAC.

Panel driver IC and cooling method thereof

A display driving module including a driving circuit portion and a non-driving circuit portion is provided. The driving circuit portion is controlled by a system circuit block. The driving circuit portion includes driving channels for driving a display panel. First ESD protection devices are disposed in the driving circuit portion corresponding to the driving channels for providing at least one discharge path. The non-driving circuit portion electrically connects the system circuit block, the driving circuit portion and the display panel. At least one of second ESD protection devices is disposed in at least one of the driving circuit portion, the non-driving circuit portion, the system circuit block and the display panel corresponding to the first ESD protection devices. The second ESD protection devices cooperate with the first ESD protection devices to provide the discharge path. An image display system including the foregoing display driving module is also provided.

Image display system and display driving module

An operational amplifier circuit configured to drive a load is provided. The operational amplifier circuit includes an output stage module. The output stage module includes a detection circuit and an output stage circuit. The detection circuit is configured to detect a current output voltage and a previous output voltage based on a comparison result of a current input voltage and the current output voltage. The detection circuit enhances a charge capacity or a discharge capacity of the output stage circuit for the load based on a detection result. Furthermore, a method for enhancing the driving capacity of the operational amplifier circuit is also provided.

Operational amplifier circuit and method for enhancing driving capacity thereof

A driving circuit includes several first electrostatic current limiting resistors and several digital to analog converter (DAC) units. First ends of these first electrostatic current limiting resistors common coupled to a global path to receive a reference voltage. These DAC units respectively coupled to second ends of the first electrostatic current limiting resistors one-on-one to receive the reference voltage through the first electrostatic current limiting resistors.

Driving circuit

A chip package structure includes a package body. The package body includes a core circuit and an electrostatic discharge protection circuit. A first connection terminal electrically is connected to the core circuit. A second connection terminal electrically is connected to the electrostatic discharge protection circuit. A first interconnection structure electrically connected to the electrostatic discharge protection circuit, the second connection terminal and a third connection terminal. A first lead electrically connects the second connection terminal and an external circuit. A second lead electrically connects the first connection terminal and the third connection terminal. The second lead and the first lead are substantially separate.

Chip package

A chip package structure includes a package body, a first lead and a second lead. Elements embedded inside the package body include a core circuit having at least one first connection terminal, at least one ESD protection circuit having at least one second connection terminal, at least one third connection terminal and at least one interconnection structure. The interconnection structure is electrically connected to the second connection terminal and the third connection terminal. The first lead on the package body is electrically connected to the second connection terminal and an external circuit. The second lead on the package body electrically connects the first connection terminal and the third connection terminal. The second lead and the first lead are separate in structure.

A driving circuit includes a plurality of reference voltage lines and a digital to analog converter. The reference voltage lines are configured for respectively transmitting different grayscale reference voltages, in which the grayscale reference voltages are divided into at least two groups, and the wire diameter/wire width of at least one reference voltage line among the reference voltage lines of a first voltage group among the at least two groups is different from the wire diameters/wire widths of the reference voltage lines of a second voltage group among the at least two groups. The digital to analog converter is coupled to the reference voltage lines to receive the grayscale reference voltages and is for converting a digital signal into a grayscale voltage according to the grayscale reference voltages.

A multi-input differential amplifier with dynamic transconductance compensation is disclosed. The multi-input differential amplifier includes an input stage, an output stage and a transconductance compensation circuit. The input stage includes a plurality of differential input pairs, which includes a first differential input pair, a second differential input pair, a third differential input pair and a fourth differential input pair, for generating a pair of differential signals according to a first input signal, a second input signal, a third input signal, a fourth input signal, and an output signal. The output stage is utilized to generate the output signal in response to the pair of differential signals. The transconductance compensation circuit is coupled between the first and the second differential input pair, for compensating a first transconductance of the first differential input pair and a second transconductance of the second differential input pair.

Growing community of inventors

Hsinchu County, Taiwan

Chun-Yung Cho