Taiwan Semiconductor Manufacturing Comp. Ltd.

Au Optronics Corporation

Industrial Technology Research Institute

Epistar Corporation

Chun-Yuan Chen

Chih-Hao Wang

Huan-Chieh Su

Cheng-Chi Chuang

Li-Zhen Yu

Yen-Ting Chiang

Dun-Nian Yaung

Ching-Chun Wang

Yu-Ming Lin

Hsiao-Hui Tseng

Jen-Cheng Liu

Shyh-Fann Ting

Wei Chuang Wu

Shih-Chuan Chiu

Pei-Yu Wang

Chia-Hao Chang

Jhy-Jyi Sze

Yu-Jen Wang

Lo-Heng Chang

Kuan-Lun Cheng

Feng-Chi Hung

Yi-Hsun Chiu

Ching-Wei Tsai

Tien-Lu Lin

Jia-Chuan You

Tzu-Jui Wang

Yuichiro Yamashita

Lin-Yu Huang

Shen-Hui Hong

Ming-Hsien Yang

Lu-Sheng Chou

Hsuan-Han Tseng

Keng-Yu Chou

Yu-Xuan Huang

Sheng-Chan Li

Yi-Bo Liao

Han-Ping Kuo

Chia-Hao Wu

Jiann-Tyng Tzeng

Wei-Cheng Lin

Yen-Yu Chen

Chih-Wei Chen

Shang-Wen Chang

Wei-An Lai

Ching I Li

Wei-Chuang Wu

Kai-Yun Yang

Hsu-Sheng Hsu

Ming Chian Tsai

Chih-Chun Chang

Chia Ching Liao

Kuan-Tsun Chen

Hou-Yu Chen

Chih-Ming Wang

Ru-Shi Liu

Sheng-Tsung Wang

Shun-Nan Liou

Ming-Jye Tsai

Hao-Yu Chen

Yih-Hua Renn

Shau-Yu Tsai

Chih-Kang Wu

Po-Lung Chen

Hou-yu Chen

Chih-Wei Chien

Chien-Chun Kuo

Hui-Kai Chou

I-Lun Ma

Chih-Ling Hsueh

Yung-Hsiang Lin

Chih-Kai Chiu

Jr-Wei Lian

Min-Hsuan Lu

Shu-Fen Hu

Kai-Shiang Gan

Yin-Ting Lee

Hao-Yuan Hou

Yung-Wen Hsu

Shih-Wei Hsieh

Chang-Tai Hisao

Chien-Hsin Wang

A method of fabricating a semiconductor device includes providing a dummy structure including channel layers disposed over a frontside of a substrate, inner spacers disposed between adjacent channels of the channel layers and at lateral ends of the channel layers, and a gate structure interposing the plurality of channel layers. The dummy structure is disposed at an active edge adjacent to an active region. Perform an etching process to etch the gate structure and the plurality of channel layers to form a cut region along the active edge. Deposit a conductive material in the cut region to form a conductive feature. The method further includes thinning the substrate from a backside of the substrate to expose the conductive feature and forming a backside metal wiring layer on the backside of the substrate. The backside metal wiring layer is in electrical connection with the conductive feature.

Semiconductor device with backside power rail

Various embodiments of the present disclosure are directed towards an image sensor having a photodetector disposed in a semiconductor substrate. The photodetector comprises a first doped region comprising a first dopant having a first doping type. A deep well region extends from a back-side surface of the semiconductor substrate to a top surface of the first doped region. A second doped region is disposed within the semiconductor substrate and abuts the first doped region. The second doped region and the deep well region comprise a second dopant having a second doping type opposite the first doping type. An isolation structure is disposed within the semiconductor substrate. The isolation structure extends from the back-side surface of the semiconductor substrate to a point below the back-side surface. A doped liner is disposed between the isolation structure and the second doped region. The doped liner comprises the second dopant.

Full well capacity for image sensor

A semiconductor device structure is provided. The semiconductor device structure includes a substrate, a conductive feature on the substrate, and an electrical connection structure on the conductive feature. The electrical connection includes a first grain made of a first metal material, and a first inhibition layer made of a second metal layer that is different than the first metal material. The first inhibition layer extends vertically along a first side of a grain boundary of the first grain and laterally along a bottom of the grain boundary of the first grain.

Semiconductor device structure and method for forming the same

The present disclosure relates to a semiconductor device having a backside source/drain contact, and method for forming the device. The semiconductor device includes a source/drain feature having a top surface and a bottom surface, a first silicide layer formed in contact with the top surface of the source/drain feature, a first conductive feature formed on the first silicide layer, and a second conductive feature having a body portion and a first sidewall portion extending from the body portion, wherein the body portion is below the bottom surface of the source/drain feature, and the first sidewall portion is in contact with the first conductive feature.

Semiconductor devices with backside power rail and methods of fabrication thereof

A device includes a substrate and a transistor on the substrate. The transistor includes a channel region that has at least one semiconductor nanostructure, and a gate electrode. A source/drain region is disposed adjacent to a first side of the channel region along a first direction. A hybrid fin structure is disposed adjacent to a second side of the channel region along a second direction that is transverse to the first direction. The hybrid fin structure includes a first hybrid fin dielectric layer and a second hybrid fin dielectric layer. The first and second hybrid fin dielectric layers include silicon, oxygen, carbon and nitrogen and have a different concentration of at least one of silicon oxygen, carbon, or nitrogen from one another.

Semiconductor device having dielectric hybrid fin

A method for forming a semiconductor device includes followings. A transistor is formed, and the transistor is embedded in a dielectric layer and disposed over a semiconductor substrate. A first gate cutting process is performed to form a first opening in the dielectric layer. An insulator post is formed in the first opening. A second gate cutting process is performed to form a second opening in the dielectric layer. A power via is formed in the second opening. A conductor is formed, wherein the conductor is embedded in the semiconductor substrate, and the conductor is located under and electrically connected to the power via.

Method for forming semiconductor device

A semiconductor device is provided. The semiconductor device has a stack of parallel metal gates formed on a first side of a substrate, a first pair of insulation regions extending across the stack of parallel metal gates, a second pair of insulation regions replacing two of the parallel metal gates, a first isolated region enclosed by the first and second pairs of insulation layers, a first via formed within the isolated region, and an insulation layer replacing the metal gates located within the isolated region. Tree or more metal gates are located within the isolated region, and the first via extends through a portion of a center one of the three metal gates within the isolated region.

Semiconductor device and method of manufacturing the same

Semiconductor structures and methods of forming the same are provided. A semiconductor structure according to one embodiment includes first nanostructures, a first gate structure wrapping around each of the first nanostructures and disposed over an isolation structure, and a backside gate contact disposed below the first nanostructures and adjacent to the isolation structure. A bottom surface of the first gate structure is in direct contact with the backside gate contact.

Backside gate contact

A semiconductor device includes a first dielectric layer, a stack of semiconductor layers disposed over the first dielectric layer, a gate structure wrapping around each of the semiconductor layers and extending lengthwise along a direction, and a dielectric fin structure and an isolation structure disposed on opposite sides of the stack of semiconductor layers and embedded in the gate structure. The dielectric fin structure has a first width along the direction smaller than a second width of the isolation structure along the direction. The isolation structure includes a second dielectric layer extending through the gate structure and the first dielectric layer, and a third dielectric layer extending through the first dielectric layer and disposed on a bottom surface of the gate structure and a sidewall of the first dielectric layer.

Semiconductor device with backside gate isolation structure and method for forming the same

A semiconductor structure includes a source/drain (S/D) region, one or more dielectric layers over the S/D region, one or more semiconductor channel layers connected to the S/D region, an isolation structure under the S/D region and the one or more semiconductor channel layers, and a via under the S/D region and electrically connected to the S/D region. A lower portion of the via is surrounded by the isolation structure and an upper portion of the via extends vertically between the S/D region and the isolation structure.

Semiconductor structure having an anchor-shaped backside via

A method includes forming a first conductive feature on a substrate, forming a via that contacts the first conductive feature, the via comprising a conductive material, performing a Chemical Mechanical Polishing (CMP) process to a top surface of the via, depositing an Interlayer Dielectric (ILD) layer on the via, forming a trench within the ILD layer to expose the via, and filling the trench with a second conductive feature that contacts the via, the second conductive feature comprising a same material as the conductive material.

Contact resistance between via and conductive line

A semiconductor structure includes an isolation structure, a source/drain region over the isolation structure, a gate structure over the isolation structure and adjacent to the source/drain region, an interconnect layer over the source/drain region and the gate structure, an isolating layer below the gate structure, and a contact structure under the source/drain region. The contact structure has a first portion and a second portion. The first portion is below the second portion. The second portion extends through the isolating layer and protrudes above the isolating layer. A portion of the isolating layer is vertically between the gate structure and the first portion of the contact structure.

Semiconductor devices with backside contacts and isolation

A semiconductor device structure is provided. The semiconductor device structure includes a stack of semiconductor nanostructures over a base structure and a first epitaxial structure and a second epitaxial structure sandwiching the semiconductor nanostructures. The semiconductor device structure also includes a gate stack wrapped around each of the semiconductor nanostructures and a backside conductive contact connected to the second epitaxial structure. A first portion of the backside conductive contact is directly below the base structure, and a second portion of the backside conductive contact extends upwards to approach a bottom surface of the second epitaxial structure. The semiconductor device structure further includes an insulating spacer between a sidewall of the base structure and the backside conductive contact.

Semiconductor nanostructures device structure with backside contact

In some embodiments, the present application provides an integrated chip (IC). The IC includes a metal-insulator-metal (MIM) device disposed over a substrate. The MIM device includes a plurality of conductive plates that are spaced from one another. The MIM device further includes a first conductive plug structure that is electrically coupled to a first conductive plate and to a third conductive plate of the plurality of conductive plates. A first plurality of insulative segments electrically isolate a second conductive plate and a fourth conductive plate from the first conductive plug structure. The MIM device further includes a second conductive plug structure that is electrically coupled to the second conductive plate and to the fourth conductive plate of the plurality of conductive plates. A second plurality of insulative segments electrically isolate the first conductive plate and the third conductive plate from the second conductive plug structure.

Metal-insulator-metal device capacitance enhancement

The present disclosure relates to an integrated chip including a dielectric structure over a substrate. A first capacitor is disposed between sidewalls of the dielectric structure. The first capacitor includes a first electrode between the sidewalls of the dielectric structure and a second electrode between the sidewalls and over the first electrode. A second capacitor is disposed between the sidewalls. The second capacitor includes the second electrode and a third electrode between the sidewalls and over the second electrode. A third capacitor is disposed between the sidewalls. The third capacitor includes the third electrode and a fourth electrode between the sidewalls and over the third electrode. The first capacitor, the second capacitor, and the third capacitor are coupled in parallel by a first contact on a first side of the first capacitor and a second contact on a second side of the first capacitor.

Multi-layer trench capacitor structure

Growing community of inventors

Hsinchu, Taiwan

Chun-Yuan Chen