Azurewave Technologies, Inc.

Fih (hong Kong) Limited

Chi Mei Communication Systems, Inc.

Chiun Mai Communication Systems, Inc.

Chun-Yu Lu

Chi-Hsing Hsu

Ming-Che Kuo

Ching-Wei Liu

Kung-Ming Kao

A near field communication device communicating with a smart terminal is presented, the near field communication device includes a controller, a near field communication (NFC) module, and a sensor. The sensor detects different operating motions of the near field communication device related to the smart terminal. The controller actuates different operating modes of the NFC module according to different operating motions detected by the sensor. An actuating method of the near field communication device is also provided.

Near field communication device and actuating method thereof

An antenna structure includes a first antenna, a second antenna, a radio frequency ('RF') circuit, and a controller. The first antenna includes a first radiating portion and a first feeding portion. The second antenna includes a second radiating portion and a second feeding portion. The second radiating portion is positioned in a first plane that is substantially parallel to a second plane in which the first radiating portion is positioned. The RF circuit is configured to output a first current signal to the first feeding portion and a second current signal to the second feeding portion. The controller is configured to control the RF circuit to adjust phases of the first current signal and the second current signal.

Antenna structure and wireless communication device employing same

A sensor package structure includes a sensing die, a light-filtering sheet, and an annular pressure-sensitive adhesive sheet. An active surface of the sensing die has a sensing region and a connecting region around the sensing region. The periphery contour of sensing die is greater than or equal to the periphery contour of light-filtering sheet. The pressure-sensitive adhesive sheet has two opposite adhesive surfaces and defines an opening. The adhesive surfaces respectively adhere to the connecting region of the sensing die and the inner surface of the light-filtering sheet, and the sensing region faces the inner surface of the light-filtering sheet via the opening. The sensing region is sealed by the pressure-sensitive adhesive sheet and the light-filtering sheet. Thus, the instant disclosure provides the sensor package structure with low cost, high capacity, and high yield. Moreover, the instant disclosure provides a production apparatus for manufacturing the sensor package structure.

Production apparatus for manufacturing sensor package structure

A portable electronic device includes a first housing, a second housing to the first housing, a circuit board, a display module, a touch panel, a near field communication (NFC) module, and a NFC antenna. The circuit board, the display module, the touch panel, the NFC module and the NFC antenna are orderly mounted in a space between the first housing and the second housing. The NFC antenna is set around the touch panel or at one side of the touch panel or the NFC module.

Portable electronic device with near field communication function

A vertical stacked light emitting structure includes a substrate unit, a stacked type light emitting module, and a flip-chip type light emitting module. The substrate unit includes a substrate body. The stacked type light emitting module includes a first light emitting unit and a light guiding unit. The first light emitting unit includes at least one first LED bare chip disposed on and electrically connected to the substrate body, and the light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The flip-chip type light emitting module includes a second light emitting unit. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Hence, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially.

Vertical stacked light emitting structure

A vertical stacked light emitting structure includes a substrate unit, a first light emitting unit, a light guiding unit, and a second light emitting unit. The substrate unit includes at least one substrate body. The first light emitting unit includes at least one first LED bare chip disposed on the substrate body and electrically connected to the substrate body. The light guiding unit includes at least one light guiding body disposed on the first LED bare chip. The second light emitting unit includes at least one second LED bare chip disposed on the light guiding body and electrically connected to the substrate body. Therefore, the first LED bare chip, the light guiding body, and the second LED bare chip are stacked on top of one another sequentially.

An LED package structure for increasing light-emitting efficiency includes a heat-dissipating unit, an insulating unit, a light-emitting unit and a conductive unit. The heat-dissipating unit has a heat-dissipating substrate. The insulating unit has an insulating layer formed on the heat-dissipating substrate and at least one receiving groove passing through the insulating layer and formed above the heat-dissipating substrate. The insulating layer has a top surface on a top side thereof and an inner surface, and the inner surface of the insulating layer is an annular inclined surface in the receiving groove. The light-emitting unit has at least one light-emitting element received in the receiving groove and disposed on the heat-dissipating substrate. The conductive unit has at least two conductive structures disposed on the insulating layer and separated from each other, and the light-emitting element has two electrodes respectively electrically connected to the two conductive structures via two conductive wires.

Growing community of inventors

Taipei, Taiwan

Chun-Yu Lu