Taiwan Semiconductor Manufacturing Comp. Ltd.

Chun-Ying Lin

Chin-Yu Ku

Chen-Shien Chen

Wei-Chih Huang

Hsu-Hsien Chen

Pi-Lan Chang

Li-Chieh Chou

Ta-Jen Yu

Hsiu-Mei Yu

Sheng-Hsiang Chiu

Young-Chang Lien

A package structure including a circuit substrate, a semiconductor die, a redistribution layer, a plurality of conductive balls and a circuit substrate is provided. The redistribution layer is disposed on the semiconductor die, and being electrically connected to the semiconductor die. The plurality of conductive balls is disposed between the redistribution layer and the circuit substrate. The semiconductor die is electrically connected to the circuit substrate through the conductive balls. Each of the conductive balls has a ball foot with a first width D, a ball head with a third width Dand a ball waist with a second width Dlocated between the ball foot and the ball head. The ball foot is connected to the redistribution layer, the ball head is connected to the circuit substrate, and the ball waist is the narrowest portion of each of the conductive balls.

Package structure having a plurality of conductive balls with narrow width for ball waist

Package structure having a plurality of conductive balls having narrow width for the ball waist

An embodiment of the disclosure includes a method of dicing a semiconductor structure. A device layer on a semiconductor substrate is provided. The device layer has a first chip region and a second chip region. A scribe line region is between the first chip region and the second chip region. A protective layer is formed over the device layer thereby over the semiconductor substrate. The protective layer on the scribe line region is laser sawn to form a notch. The notch extends into the semiconductor substrate and the protective layer is formed to cover a portion of the notch. A mechanically sawing is performed through the portion of the protective layer and the substrate to separate the first chip region and the second chip region.

Methods of dicing a semiconductor structure

Growing community of inventors

Yunlin County, Taiwan

Chun-Ying Lin