Taiwan Semiconductor Manufacturing Comp. Ltd.

Geosat Aerospace & Technology

Geostat Aerospace & Technology Inc.

Chun-Yi Wu

Chen-Shien Chen

Chin-Yu Ku

Hon-Lin Huang

Wei-Li Huang

Chi-Cheng Chen

Chih-Hung Su

Kuang-Yi Wu

Cheng-Fang Lo

Zih-Siou Chen

Chang-Rong Ko

Kuang-Yu Chen

Hsiu-Hsien Wen

Te-Che Lin

Ting-Jung Chang

Ya-Wen Cheng

A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation layer extending exceeding edges the magnetic element. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding the edges of the magnetic element.

Semiconductor device structure with magnetic element

A semiconductor device structure is provided. The semiconductor device structure includes a substrate and a magnetic element over the substrate. The semiconductor device structure also includes an isolation element over the magnetic element. The i magnetic element is wider than the isolation element. The semiconductor device structure further includes a conductive line over the isolation element.

A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an isolation layer covering the magnetic element and a portion of the semiconductor substrate. The isolation layer contains a polymer material. The semiconductor device structure further includes a conductive line over the isolation layer and extending exceeding edges of the magnetic element.

Semiconductor device structure with magnetic element covered by polymer material

A semiconductor device structure is provided. The semiconductor device structure includes a semiconductor substrate and a magnetic element over the semiconductor substrate. The semiconductor device structure also includes an isolation element over the magnetic element. The isolation element partially covers a top surface of the magnetic element. The semiconductor device structure further includes a conductive line over the isolation element. In addition, the semiconductor device structure includes a dielectric layer over the conductive line and the magnetic element.

A structure and a formation method of a semiconductor device are provided. The method includes forming a passivation layer over a semiconductor substrate. The method also includes forming a magnetic element over the passivation layer. The method further includes forming an isolation layer over the magnetic element and the passivation layer. The isolation layer includes a polymer material. In addition, the method includes forming a conductive line over the isolation layer, and the conductive line extends across the magnetic element.

Structure and formation method of semiconductor device with magnetic element covered by polymer material

A structure and a formation method of a semiconductor device are provided. The method includes forming an etch stop layer over a semiconductor substrate and forming a magnetic element over the etch stop layer. The method also includes forming an isolation element extending across the magnetic element. The isolation element partially covers the top surface of the magnetic element and partially covers sidewall surfaces of the magnetic element. The method further includes forming a conductive line over the isolation element. In addition, the method includes forming a dielectric layer over the conductive line, the isolation element, and the magnetic element.

Structure and formation method of semiconductor device with magnetic element

Methods and systems for detecting objects from aerial imagery are disclosed. The method includes obtaining an image of an area, obtaining a plurality of regional aerial images from the image of the area, classifying the plurality of regional aerial images as a first class or a second class by a classifier, wherein: the first class indicates a regional aerial image contains a target object, the second class indicates a regional aerial image does not contain a target object, and the classifier is trained by first and second training data, wherein the first training data include first training images containing target objects, and the second training data include second training images containing target objects obtained by adjusting at least one of brightness, contrast, color saturation, resolution, or a rotation angle of the first training images; and recognizing a target object in a regional aerial image in the first class.

Methods and systems for automatic object detection from aerial imagery

Methods and systems for detecting objects from aerial imagery are disclosed. According to certain embodiments, the method may include obtaining a Digital Surface Model (DSM) image of an area. The method may also include obtaining a DSM image of one or more target objects. The method may further include detecting the target object in the area based on the DSM images of the area and the one or more target objects. The method may further include recognizing the detected target objects by artificial intelligence. The method may further include acquiring the positions of the recognized target objects. The method may further include calculating the number of the recognized target objects.

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Tainan, Taiwan

Chun-Yi Wu