Taiwan Semiconductor Manufacturing Comp. Ltd.

Chun-Wen Lin

Chen-Hua Douglas Yu

Chuei-Tang Wang

Chung-Hao Tsai

Che-Wei Hsu

A package structure includes at least one integrated circuit component, an insulating encapsulation, and a redistribution structure. The at least one integrated circuit component includes a semiconductor substrate, an interconnection structure disposed on the semiconductor substrate, and signal terminals and power terminals located on and electrically connecting to the interconnection structure. The interconnection structure is located between the semiconductor substrate and the signal terminals and between the semiconductor substrate and the power terminals, and where a size of the signal terminals is less than a size of the power terminals. The insulating encapsulation encapsulates the at least one integrated circuit component. The redistribution structure is located on the insulating encapsulation and electrically connected to the at least one integrated circuit component.

Growing community of inventors

Changhua County, Taiwan

Chun-Wen Lin