Taiwan Semiconductor Manufacturing Comp. Ltd.

Realtek Semiconductor Inc.

TSMC Nanjing Company, Limited

Chun-Wei Kuo

I-Chih Chen

Yi-Chun Huang

Jia-Ching Shen

A method of forming a semiconductor structure includes forming a plurality of lower level conductive lines in a first dielectric layer. The plurality of lower level conductive lines includes a first lower level conductive line. The method further includes recessing portions of the first lower level conductive line below a top surface of the first dielectric layer to form a recess, forming a dielectric cap in the recess, depositing a second dielectric layer over the first dielectric layer. Forming a via opening exposes a portion of the second lower level conductive line. The method further includes forming an upper level conductive line and a via in the trench and in the via opening, respectively. The via couples the upper level conductive line to the second lower level conductive line, and the upper level conductive line overlaps with the dielectric cap.

Method of back end of line via to metal line margin improvement

A semiconductor structure includes a first conductive line and a second conductive line in a first dielectric layer, and a third conductive line in a second dielectric layer overlying the first dielectric layer. The first conductive line and the second conductive line each extend along a first direction. The third conductive line extends along a second direction different from the first direction and above at least the second conductive line. The semiconductor structure further includes a via in the second dielectric layer and electrically connecting the second conductive line and the third conductive line. The via lands on a portion of the second conductive line. The semiconductor structure further includes a dielectric cap over the first conductive line. A bottom surface of the dielectric cap is below a top surface of the first dielectric layer.

Back end of line via to metal line margin improvement

A communication apparatus having power saving mode includes memory circuit unit and DMA module. The memory circuit unit is used for storing instruction and data information to be executed by microcontroller (or control circuit) of communication apparatus, and the DMA module is used to backup the instruction and data information and store such information into a memory of an electronic device when the communication apparatus receives a broadcast synchronization signal periodically sent from another communication device. During the power saving mode, the memory circuit unit is powered down. When leaving the power saving mode, the memory circuit unit is powered on, and the DMA module retrieves the instruction and data information from the memory of the electronic device and write such information into the memory circuit unit.

Communication apparatus having power saving mode and capable of saving more power in power saving mode

A wireless communication apparatus is adapted for communication between a host and a communication device. The wireless communication apparatus includes a host transmission interface adapted to be coupled to the host, a host transmission interface controller coupled to the host transmission interface, a wireless transmission interface adapted for communicating with the communication device so as to receive packet data therefrom, a wireless transmission interface controller coupled to the wireless transmission interface, and a processor coupled between the host transmission interface controller and the wireless transmission interface controller. The processor is operable to control a power state of the host transmission interface controller to enter a power consuming mode selected in accordance with a traffic volume.

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Tainan, Taiwan

Chun-Wei Kuo