Taiwan Semiconductor Manufacturing Comp. Ltd.

Chun-wei Chang

Jian-Hong Lin

Yinlung Lu

Jun He

Wei-Cheng Liu

Shu-Yuan Ku

Shu-yuan Ku

A package component includes a first substrate and a first conductive layer. The first substrate has a first surface and a second surface opposite to the first surface. The first conductive layer is disposed over the first surface of the first substrate. The first conductive layer includes a first conductive feature and a second conductive feature over the first conductive feature. The second conductive features covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the second conductive feature. The first substrate includes a single-sided or a double-sided copper-clad laminate.

Package component

A package component and forming method thereof are provided. The package component includes a substrate and a conductive layer. The substrate includes a first surface. The conductive layer is disposed over the first surface. The conductive layer includes a first conductive feature and a second conductive feature. The second conductive feature covers a portion of the first conductive feature. A resistance of the second conductive feature is lower than a resistance of the first conductive feature.

Package component and forming method thereof

Growing community of inventors

TAOYUAN COUNTY, Taiwan

Chun-wei Chang