Etron Technology, Inc.

Invention and Collaboration Laboratory Pte. Ltd.

Industrial Technology Research Institute

Eton Technology, Inc.

Chun Shiah

Bor-Doou Rong

Chao-Chun Lu

Yu-Hui Sung

Cheng-Nan Chang

Tah-Kang Joseph Ting

Ho-Yin Chen

Sen-Fu Hong

Hsien-Sheng Huang

Shi-Huei Liu

Feng-Chia Chang

Hao-Jan Yang

Tzu-Jen Ting

Der-Min Yuan

Ming-Hung Wang

Jeng-Tzong Shih

Yu-Sheng Lai

Chun-Peng Wu

Yen-An Chang

Gyh-Bin Wang

Shih-Hsing Wang

Yung-Ching Hsieh

Kuang-Fu Teng

Shi Huei Liu

Chi-Wei Yen

Yu-Chou Ke

Po-Hung Chen

Wen-Wey Chen

Kuo-Chen Lai

Hung-Jen Chang

Chia-Ming Chen

Ching-Ying Hsu

Chi-Fa Lien

Tzu Jen Ting

Chun-Chi Shen

This invention discloses sustainable DRAM with principle power supply voltage which is unified with an external logic circuit. The DRAM circuit is configured to couple with the external logic circuit and with a principle power supply voltage source. The DRAM circuit comprises a first sustaining voltage generator and a DRAM core circuit. The first sustaining voltage generator generates a first voltage level which is higher than a voltage level corresponding to a signal ONE utilized in the DRAM circuit. The DRAM core circuit has a DRAM cell comprising an access transistor and a storage capacitor, and the storage capacitor of the DRAM cell is configured to selectively coupled to the first sustaining voltage generator. Wherein, a voltage level of the principle power supply voltage source to the DRAM circuit is the same or substantially the same as that of a principle power supply voltage source to the external logic circuit.

Sustainable DRAM having principle power supply voltage unified with logic circuit

The present invention relates to DRAM with sustainable storage architecture. The DRAM comprises a DRAM cell with an access transistor and a storage capacitor, and a word line coupled to a gate terminal of the access transistor. During the period between the word line being selected to turn on the access transistor and the word line being unselected to turn off the access transistor, either a first voltage level or a second voltage level is stored in the DRAM cell, wherein the first voltage level is higher than a voltage level of a signal ONE utilized in the DRAM, and the second voltage level is lower than a voltage level of a signal ZERO utilized in the DRAM.

Dynamic memory with sustainable storage architecture

The invention relates to DRAM with sustainable storage architecture. The DRAM comprises a first supplying voltage source generating a voltage level corresponding to signal ONE utilized in the DRAM chip, and a DRAM cell which includes an access transistor and a storage capacitor. Wherein a first voltage level is higher than the voltage level corresponding to signal ONE, and the first voltage level is generated by a first sustaining voltage generator. The first sustaining voltage generator is electrically coupled to the storage capacitor of the DRAM cell during a turning-off period of the access transistor of the DRAM cell. A clean up circuit is provided to mitigate the difference between the voltages of BL/BLB and the targeted reference voltage during the equalization period.

Dynamic memory with sustainable storage architecture and clean up circuit

The invention relates to DRAM with sustainable storage architecture. The DRAM comprises a DRAM cell with an access transistor and a storage capacitor, and a word-line coupled to a gate terminal of the access transistor. During the period between the word-line being selected to turn on the access transistor and the word line being unselected to turn off the access transistor, either a first voltage level or a second voltage level is stored in the DRAM cell, wherein the first voltage level is higher than a voltage level of a signal ONE utilized in the DRAM, and the second voltage level is lower than a voltage level of a signal ZERO utilized in the DRAM.

Dynamic memory with long retention time

A memory system comprises a memory and a physical layer circuit. The memory system comprises a memory, a data bus and a single-pin STB. The memory receives a parallel command though the data bus, and receives a serial command through the STB. The physical layer circuit is configured to transmit the parallel command to the data bus. The physical layer circuit is configured to convert STB input data from the controller into the serial command and transmit the serial command to the STB.

Memory system, memory controller and memory chip

A memory controller includes a command processor. When an access command is performed by the memory controller, the command processor generates a row address information to the memory before issuing an active command to the memory. The row address information and the active command are issued by the command processor based on the access command.

Memory controller and related memory

A memory circuit includes a plurality of banks and a controller, each bank of the plurality of banks includes a plurality of segments, and each segment of the plurality of segments includes a plurality of bit lines and a plurality of word lines. A word line switch corresponding to a word line of a segment of the memory circuit is turned on and data are written into memory cells of the segment coupled to a plurality of bit lines of the segment and corresponding to the word line in turn after the controller enables an active command corresponding to the word line. When the controller enables at least one copy row write command, the data are simultaneously written into memory cells sharing a plurality of sense amplifiers with the plurality of bit lines of the segment and corresponding to at least one another word line.

Memory circuit with improved read and write access

A memory circuit capable of being quickly written in data includes a plurality of banks, and each bank of the plurality of banks includes a plurality of segments. Each segment of the plurality of segments includes a plurality of bit line groups, and each bit line group of the plurality of bit line groups corresponds to a pre-charge line. When a predetermined signal is enabled, a potential is written into memory cells of the each segment corresponding to the each bit line group through the pre-charge line and the each bit line group.

Memory circuit capable of being quickly written in data

A circuit for outputting information of a memory circuit during a self-refresh mode includes a driver. The driver is coupled to a self-refresh control circuit and a self-refresh address counter. The driver is used for driving a plurality of pads of the memory circuit to output information of a plurality of inner signals corresponding to a self-refresh mode signal, and output information of addresses of a plurality of word lines of the memory circuit when the self-refresh mode signal and a test mode signal are enabled and the memory circuit enters the self-refresh mode. Each word line of the plurality of word lines corresponds to an inner signal of the plurality of inner signals.

Circuit for outputting information of a memory circuit during a self-refresh mode and related method thereof

A method for reducing current consumption of a memory is disclosed, wherein the memory includes a controller and a plurality of banks, and each bank of the plurality of banks includes a plurality of segments. The method includes the controller enabling an activating command corresponding to a first row address and an address of a first bank of the plurality of banks; a word line switch of a segment of the first bank corresponding to the first row address being turned on according to the activating command; the controller enabling an access command corresponding to an address of the segment; a plurality of bit switches corresponding to the segment being turned on according to the access command; and the controller enabling a pre-charge command corresponding to an address of a following segment and the address of the first bank after the access command is disabled.

Memory with low current consumption and method for reducing current consumption of a memory

A bundled memory includes a substrate, a first memory die, a second memory die, a scribe line, and an electrical connection. The first memory die has a first input/output bus, and the second memory die has a second input/output bus, where the first memory die and the second memory die are formed over the substrate. The scribe line is formed between the first memory die and the second memory die. The electrical connection is formed over the scribe line for electrically connecting to the first input/output bus and the second input/output bus, where the electrical connection is electrically connected to an external input/output bus, where a size of the external input/output bus of the bundled memory is larger than or equal to a size of the first input/output bus and a size of the second input/output bus.

Bundled memory and manufacture method for a bundled memory with an external input/output bus

A memory with variable operation voltage is disclosed. The disclosed DRAM comprises a core memory module, a register, and a first voltage adjustment module. The core memory module operates with a first control voltage. The register is used for storing a plurality of control signals and selecting one among the control signals as a voltage control signal according to an input signal. The first voltage adjustment module is respectively electrically connected to the register, the core memory module, and an external voltage, so as to provide the first control voltage according to the voltage control signal and the external voltage.

Memory with variable operation voltage and the adjusting method thereof

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Hsinchu, Taiwan

Chun Shiah