Omnivision Technologies, Inc.

Omnivision Semiconductor (Shanghai) Co., Ltd.

Himax Display, Inc.

Chun-Sheng Fan

Wei-Feng Lin

Pei-Wen Ko

Chen-Wei Tsai

Yeh-An Chien

Jau-Jan Deng

Wei-Ping Chen

Teng-Sheng Chen

Regis Fan

Ying-Chih Kuo

Yi-Wei Liu

Da-Shuang Kuan

Chien-Chan Yeh

Wei-Feng Huang

Chia-Te Lin

Cheng Hu

Yen-Sung Wang

An image sensor and method for fabricating are provided. The image sensor includes: a semiconductor substrate with multiple pixel regions formed thereon; adhesive frame formed on the semiconductor substrate, the adhesive frame including a peripheral adhesive frame arranged along the periphery of the semiconductor substrate and multiple reaction well adhesive frames disposed within the peripheral adhesive frame; a biological liquid crystal filled at least in each of the reaction well adhesive frames, the biological liquid crystal having an antigen-modified or an antibody-modified liquid crystal sensing interface; a glass coverplate disposed opposite to the semiconductor substrate; and a bonding layer, bonding the adhesive frames to the glass coverplate and loses a bonding power when heated or irradiated by UV light.

Image sensor and method for fabricating same

A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.

Endoscope tip assembly using cavity interposer to allow coplanar camera and LEDs

A curved-surface image-sensor assembly has a porous carrier having a concave surface with a thinned image sensor bonded by an adhesive to its concave surface of the porous carrier; the porous carrier is mounted into a water-resistant package. The sensor assembly is made by fabricating a thinned, flexible, image-sensor integrated circuit (IC) and applying adhesive to a non-illuminated side of the IC; positioning the IC over a concave surface of a porous carrier; applying vacuum through the porous carrier to suck the IC onto the concave surface of the porous carrier; and curing the adhesive to bond the IC to the concave surface of the porous carrier.

Apparatus and method for curved-surface image sensor

The present invention provides a LCOS structure and a method for fabricating same. The LCOS structure includes: a silicon substrate; a liquid crystal layer and a transparent conductive layer both disposed above the silicon substrate. In the silicon substrate, there are formed a conductive pad, an opening where the conductive pad is exposed, and at least one metal layer. The opening is located peripherally around the liquid crystal layer, there is no portion of the metal layer located under the conductive pad. The conductive backing is located at the same vertical level as one metal layer in the at least one metal layer and electrically connected thereto, a conductive adhesive fills in the opening and a gap between the silicon substrate and the transparent conductive layer. The transparent conductive layer is electrically connected to the conductive pad by conductive metal particles in the conductive adhesive.

LCOS structure and method of forming same

An active-pixel device assembly with stray-light reduction includes an active-pixel device including a semiconductor substrate and an array of active pixels, a light-transmissive substrate disposed on a light-receiving side of the active-pixel device, and a rough opaque coating disposed on a first surface of the light-transmissive substrate and forming an aperture aligned with the array of active pixels, wherein the rough opaque coating is rough so as to suppress reflection of light incident thereon from at least one side. A method for manufacturing a stray-light-reducing coating for an active-pixel device assembly includes depositing an opaque coating on a light-transmissive substrate such that the opaque coating forms a light-transmissive aperture, and roughening the opaque coating to form a rough opaque coating, said roughening including treating the opaque coating with an alkaline solution.

Active-pixel device assemblies with rough coating for stray-light reduction, and methods for manufacture

A semiconductor structure is provided. The semiconductor structure includes: a substrate having a cavity recessed from a top surface of the substrate toward a bottom surface of the substrate opposite to the top surface, wherein the cavity has a sidewall and a bottom surface, and the bottom surface of the cavity is substantially parallel to the top surface of the substrate; a light source structure in the cavity, and the light source structure emitting a light from a sidewall of the light source structure; and a diffractive optical element (DOE) over the top surface of the substrate; wherein the sidewall of the cavity is a sloped surface, so that when the light is incident on the sidewall, the sloped surface reflects the incident light to generate a reflected light toward the DOE. Associated semiconductor structure and manufacturing method are also disclosed.

Semiconductor structure and method of manufacturing the same

A diffractive optical element (DOE) comprises a first part comprising a first transparent non-conductive base and a first transparent conductive layer disposed on the first transparent non-conductive base and a second part comprising a second transparent non-conductive base and a second transparent conductive layer disposed on the second transparent non-conductive base. The first transparent conductive layer and the second transparent conductive layer have periodical patterns of thickness for diffracting light. Spacers separate the first part and the second part. The first part and the second part are positioned such that the first transparent conductive layer is facing the second transparent conductive layer. A first end of the first transparent conductive layer is electrically connected to a first terminal of a capacitance monitor, and a second end of the second transparent conductive layer is electrically connected to a second terminal of the capacitance monitor. The capacitance monitor constantly monitors the capacitance across the first transparent conductive layer and the second transparent conductive layer during an operation comprising diffracting a laser beam.

Diffractive optical elements made of conductive materials

A LCOS display panel comprises a silicon substrate, a pixel structure on the silicon substrate, a first and a second PI (polyimide) layers, a LC (liquid crystal) layer between the first and the second PI layers, wherein the second PI layer is disposed on the pixel structure, and the LC layer is disposed on the second PI layer, a glass substrate, an ITO (indium tin oxide) layer, a dam sealing a perimeter of the LCOS display panel to enclose the LC layer within the dam, wherein the dam is disposed between the first and second PI layers, and holds the silicon substrate and the glass substrate together, and a UV (ultra violet) cut filter in an active area of the LCOS display panel, wherein the active area of the LCOS display panel includes the LC layer and the pixel structure.

LCOS display panel having UV cut filter

An image sensor chip-scale package includes a pixel array, a cover glass covering the pixel array, a dam, and an adhesive layer. The pixel array is embedded in a substrate top-surface of a semiconductor substrate. The semiconductor substrate includes a plurality of conductive pads in a peripheral region of the semiconductor substrate surrounding the pixel array. The dam at least partially surrounds the pixel array and is located (i) between the cover glass and the semiconductor substrate, and (ii) on a region of the substrate top-surface between the pixel array and the plurality of conductive pads. The adhesive layer is (i) located between the cover glass and the semiconductor substrate, (ii) at least partially surrounding the dam, and (iii) configured to adhere the cover glass to the semiconductor substrate.

Image sensor chip-scale-package

A cavityless chip-scale image-sensor package includes a substrate, a microlens array, and a low-index layer. The substrate includes a plurality of pixels forming a pixel array. The microlens array includes a plurality of microlenses each (i) having a lens refractive index, (ii) being aligned to a respective one of the plurality of pixels and (iii) having a non-planar microlens surfaces facing away from the respective one of the plurality of pixels. The low-index layer has a first refractive index less than the lens refractive index. The low-index layer also includes a bottom surface, at least part of which is conformal to each non-planar microlens surface. The microlens array is between the pixel array and the low-index layer.

Cavityless chip-scale image-sensor package

An optical element comprising a transparent substrate and an anti-reflective coating, wherein the anti-reflective coating further comprises at least a transparent, high refractive index layer and a transparent, low refractive index layer, wherein the high refractive index layer is in contact with the low refractive index layer; and wherein the high refractive index layer is situated at an interface between the anti-reflective coating and air. Further, the low refractive index layer may be silicon oxide; the high refractive index layer may be tantalum oxide or silicon nitride.

Anti-reflective coating with high refractive index material at air interface

An example liquid crystal display device includes a circuit substrate, an array of conductive mirrors formed on the substrate, a light absorbing material disposed between the conductive mirrors, a transparent plate disposed over the array of conductive mirrors, and liquid crystal material disposed between the conductive mirrors and the transparent plate. The light absorbing material can also be disposed around the peripheral region of the array of the conductive mirrors. In an example display, the light absorbing material is black and/or has a light absorbing efficiency of at least fifty percent.

LCOS display with light absorbing material between pixels

An image-sensor package includes a cover glass, an image sensor, and an integrated circuit. The cover glass has a cover-glass bottom surface, to which the image sensor is bonded. The integrated circuit is beneath the cover-glass bottom surface, adjacent to the image sensor, and electronically connected to the image sensor. A method for packaging an image sensor includes attaching an image sensor to a cover-glass bottom surface of a cover glass, a light-sensing region of the image sensor facing the cover-glass bottom surface. The method also includes attaching an integrated circuit to the cover-glass bottom surface, a top IC-surface of the integrated circuit facing the cover-glass bottom surface.

Image-sensor package and associated method

An image sensor is disclosed which includes a substrate, a pixel array, a peripheral circuit, an SPAD detector and a VCSEL integrated in the substrate. The peripheral circuit is configured to process an electrical signal obtained from photoelectric conversion in the pixel array, the SPAD detector is configured to convert a first external optical pulse into an electrical pulse to provide a clock signal to the peripheral circuit. The VCSEL is driven by the peripheral circuit and configured to output a second optical pulse. The number of electrical connection terminals in the image sensor is reduced to only two, which is favorable to the miniaturization of the image sensor and simplifies the design of the mating device while allowing the inputting of a first optical pulse and outputting of a second optical pulse. By using these optical signals, extremely high speed and high bandwidth data transmission can be achieved.

Image sensor

An endoscope comprises a FPC (flexible printed circuit) having a first side and a second side, where the FPC comprises a first head part, a body part, and tail part. At least one solder pad is on the first side of the first head part, and at least one solder pad is on the first side of the body part. The endoscope further comprises a camera module mounted on the first side of the body part and a first LED (light emitting diode). A first side of the first LED is mounted on the first side of the first head part and a second side of the first LED is mounted on a first side of the camera module, while the first head part is bent. The second side of the body part is mounted on an end of a flexible fiber, and the tail part of the FPC is bent to mount on the flexible fiber.

Growing community of inventors

Hsinchu, Taiwan

Chun-Sheng Fan