Metal Industries Research & Development Centre

Chun-Ming Yang

Chorng-Tyan Lin

Shi-Wei Lin

Chih-Chin Wen

Chih-chin Wen

Jwu-jiun Yang

Fu-I Chou

Wan-Shan Yin

An automatic positioning method and an automatic control device are provided. The automatic control device includes a processing unit, a memory unit, and a camera unit to automatically control a robotic arm. When the processing unit executes a positioning procedure, the camera unit obtains a first image of the robotic arm. The processing unit analyzes the first image to establish a three-dimensional working environment model and obtains first spatial positioning data. The processing unit controls the robotic arm to move a plurality of times to sequentially obtain a plurality of second images of the robotic arm by the camera unit and analyzes the second images and encoder information of the robotic arm to obtain second spatial positioning data. The processing unit determines whether an error parameter between the first spatial positioning data and the second spatial positioning data is less than a specification value to end the positioning procedure.

Automatic positioning method and automatic control device

An optical image capturing module and an alignment method and an observation method for an upper substrate and a lower substrate using the optical image capturing module are provided. The upper substrate and the lower substrate are disposed opposite. The alignment method includes the following steps of: emitting a light ray; filtering the light ray and dividing the light ray into a light ray at first wavelength and a light ray at second wavelength, whereby the light ray at first wavelength irradiates a pattern on the upper substrate, and the light ray at second wavelength irradiates a pattern on the lower substrate; reflecting the pattern on the upper substrate to an image capturing device; reflecting the pattern on the lower substrate to the image capturing device; and determining the positions of the pattern on the upper substrate and the pattern on the lower substrate on the image capturing device.

Optical image capturing module, alignment method, and observation method

A method of aligning an upper substrate and a lower substrate is provided. The upper and lower substrates are oppositely arranged, and the aligning method includes the following steps: providing an optical image capturing module; emitting light rays to a third surface of a first prism; filtering the light rays, so that the light rays are divided into light rays at the first wavelength range and light rays at the second wavelength range, wherein the light rays at the first wavelength range irradiate a pattern on the upper substrate, and light rays at the second wavelength range irradiate a pattern on the lower substrate; reflecting a pattern image on the upper substrate to an image capturing apparatus; reflecting a pattern image on the lower substrate to the image capturing apparatus; and determining locations of the patterns of the upper and lower substrate that are on the image capturing apparatus.

Optical image capturing module, aligning method, and observing method

A method for aligning substrates in different spaces and having different sizes includes: capturing actual local images of two substrates; comparing specific marks in standard local feature regions of the two substrates, and obtaining specific marks in actual local feature regions of the two substrates; separately establishing actual coordinate systems of the two substrates to synthesize aligned assembly coordinate system; comparing coordinate values of the specific marks of the two substrates in the two actual coordinate systems to obtain first group of offsets, and comparing sizes of the two substrates to obtain a size difference; using the first group of offsets and the size difference to correct coordinate values of specific marks of one of the two substrates; comparing coordinate values of the specific marks of the two substrates, to obtain second group of offsets; and moving the one to a position compensated by the second group of offsets.

Method for aligning substrates in different spaces and having different sizes

An alignment method for assembling substrates in different spaces without fiducial mark and its system are provided, and the alignment method has steps of: pre-defining partially standard character regions of two substrates; capturing at least two partially actual images of two substrates in different waiting spaces, respectively; comparing to obtain at least two partially actual character regions of the two substrates, respectively; building actual coordinate systems of the two substrates, respectively; comparing the actual coordinate systems of the two substrates with each other to obtain a set of offset values; moving the two substrates from the different waiting spaces to an alignment-and-installation space based on the set of offset values and a predetermined movement value, respectively; and stacking the two substrates with each other to finish the alignment and installation in the alignment-and-installation space.

Alignment method for assembling substrates in different spaces without fiducial mark and its system

An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment.

Growing community of inventors

Kaohsiung, Taiwan

Chun-Ming Yang