IV Technologies Co., Ltd.

Chun-Ming Ting

Kun-Che Pai

Yu-Hao Pan

Chung-Ru Wu

A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.

Growing community of inventors

Yunlin County, Taiwan

Chun-Ming Ting