Advanced Semiconductor Engineering, Inc.

Coretronic Corporation

Chun-Min Wu

Chien-Sheng Liu

Shu-Yu Lin

Yi Chang

Cheng-Lin Li

An apparatus and method for manufacturing a semiconductor package structure are provided. The method includes: providing a process line comprising a first semiconductor manufacturing portion configured to provide a first operation including a first process step, and a second semiconductor manufacturing portion configured to provide a second operation including a second process step; passing a packaging structure through the second semiconductor manufacturing portion, wherein the second semiconductor manufacturing portion applies the second process step to the packaging structure; passing the packaging structure through the first semiconductor manufacturing portion, wherein the first semiconductor manufacturing portion applies the first process step to the packaging structure; and passing the packaging structure through the second semiconductor manufacturing portion again without applying the second process step thereon.

Apparatus and method for manufacturing semiconductor package structure

An optical module and a projector including the optical module are provided. The optical module includes a base, a first frame body disposed in the base, an optical element disposed in the first frame body, and at least one driving assembly disposed between the base and the first frame body. The first frame body is configured to swing relative to the base through a magnetic force generated by the at least one driving assembly, and each of the at least one driving assembly includes a coil and a magnetic structure that is separated from the coil and includes a magnetic permeable plate, a separation medium, and a magnet element. The separation medium is located on one side of the magnetic permeable plate facing the coil. The magnet element is disposed on the side of the magnetic permeable plate facing the coil and is separated by the separation medium.

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Kaohsiung, Taiwan

Chun-Min Wu