Htc Corporation

Chun-Lung Chu

Wei-Cheng Liu

Chien-Hung Lin

Cheng-Chieh Chuang

Chi-Jen Lu

Tim Chung-Ting Wu

Tung-Hsin Yeh

Chih-Kuang Wang

Chin Kai Sun

Jhih-Ming Jhang

Chin-Kai Sun

Chih-Yao Kuo

Ching-Ho Li

Jia Shan Wu

A head-mounted display device includes a body, two adjustment rings, and a face gasket. The body has two zoom lens groups corresponding to both eyes. The two adjustment rings are used to be detachably assembled to the corresponding zoom lens group, respectively. The face gasket is used to be detachably assembled to the body and used to contact a user's face. The face gasket has two adjustment knobs. Each of the adjustment knobs is used to couple the corresponding adjustment ring and rotate the corresponding zoom lens group for zooming, and a part of the each of the adjustment knobs is exposed to the outside for the user to manipulate.

Head-mounted display device

A neck-mounted power bank is suitable for being hung on a user's neck to supply power to an electronic device. The neck-mounted power bank includes a body, a battery, and a pair of adjustable assemblies. The battery is disposed in the body. The pair of adjustable assemblies are respectively connected to two ends of the body, and define a wearing space with the body. The pair of adjustable assemblies can be rotated relative to the body so as to adjust the size of the wearing space. Each of the pair of adjustable assemblies includes a rotate arm and an angle arm. The rotate arm is rotatably connected to a corresponding end of the body. The angle arm is connected to the rotate arm and has a contact surface. The contact surface is suitable for contacting the user's neck.

Neck-mounted power bank

A head-mounted display device includes a display, two brackets, two buckles, and a headband module. The display has two buckling parts respectively located on opposite sides of the display. The brackets are respectively pivotally connected to opposite sides of the display. The buckles are respectively pivotally connected to the brackets. When the buckles are buckled onto the buckling parts, an unfolding angle of each bracket is limited to be greater than a locked angle. When the unfolding angle of each bracket is greater than an unlocked angle, the buckles are separated from the buckling parts. The unlocked angle is greater than the locked angle. When the buckles are separated from the buckling parts, the unfolding angle of each bracket is smaller than the locked angle. Opposite sides of the headband module are respectively detachably assembled to an end of each bracket away from the display.

A head mounted display device including a host, a first bracket and a second bracket is provided. The opposite sides of the host respectively have a first connection port and a second connection port. The first bracket is detachably and electrically connected to the first connection port. The second bracket is detachably connected to the second connection port.

Head mounted display device

A head mounted display device including a host, two brackets, and two rotating components is provided. The two brackets are respectively pivotally connected to opposite sides of the host. Each bracket includes a first segment and a second segment. The first segment is pivotally connected to the second segment, and the first segment is pivotally connected to the host. The two rotating components are respectively assembled to the first segment and the second segment of each bracket to control an angle between the first segment and the second segment.

Head mounted display device to provide adjustable clamping force

A glasses type display device including a front end assembly and a pair of legs is provided. Each of the pair of legs includes a front segment, a rear segment, a torsion mechanism, and a rotation mechanism. The torsion mechanism is disposed between the front end assembly and the front segment. The rotation mechanism is disposed between the front segment and the rear segment.

Glasses type display device

A method of manufacturing a casing of an electronic device including the following steps is provided. A metallic housing is provided, wherein the metallic housing has an inner surface and an outer surface opposite to the inner surface and includes a back region and at least one side region. At least one gap, a plurality of apertures and a non-conductive layer are formed on the inner surface of the metallic housing, wherein the apertures is formed on a surface of the at least one gap, part of the non-conductive layer is formed in the at least one gap and extended from the back region to the at least one side region, and part of the non-conductive layer is extended into the apertures. Part of the metallic housing is removed for exposing part of the non-conductive layer, thereby forming a plurality of non-conductive spacers located in the at least one gap.

Metallic housing of electronic device

A case assembly and a wireless communication device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side, the metal case includes a hollow portion and an antenna portion, the hollow portion is adjacent to a side of the antenna portion. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case, partially covers the inner side of the metal case, and fills the hollow portion. The wireless communication device includes a case assembly and a radio frequency signal module. The radio frequency signal module is electrically connected to the antenna portion of the case assembly. Thus, the structural rigidity of the wireless communication device and its case assembly is kept, and the production cost is reduced.

Wireless communication device and case assembly

A metallic housing of an electronic device including an inner surface, an outer surface and a first non-conductive spacer is provided. The outer surface is opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first gap and the second gap each communicates the inner surface and the outer surface. The first non-conductive spacer is disposed the first gap of the metallic housing.

A case assembly and an electronic device are provided. The case assembly includes a metal case and a plastic cladding body. The metal case includes an inner side and an outer side, the inner side is opposite to the outer side. The metal case further includes a channel which is concavely disposed on the inner side to divide the inner side into a plurality of thermal insulation areas. The plastic cladding body is disposed on the metal case, and completely covers the outer side of the metal case. The electronic device includes a case assembly and a plurality of heart sources. The heart sources are corresponded to the thermal insulation areas on the inner side of the metal case respectively. Thus, the case assembly and the electronic device are able to prevent the heat produced from elements effect each other.

Case assembly and electronic device

A casing of an electronic device including a metallic housing, a first non-conductive spacer and a second non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing having a first gap and a second gap substantially located at two opposite ends of the metallic housing and being parallel with each other. The first non-conductive spacer is disposed the first gap, and the second non-conductive spacer is disposed in the second gap.

Casing of electronic device

A heat dissipation module and an electronic device are provided. The heat dissipation module includes a first heat transfer member, a second heat transfer member, and a cooling element. The first heat transfer member has a first end and a second end opposite to the first end. The second heat transfer member has a third end and a fourth end opposite to the third end. The cooling element disposed between the second end and the third end is configured to allow or block the heat transferring between the second end and the third end.

Heat dissipation module and electronic device

A casing of an electronic device including a metallic housing and a first non-conductive spacer is provided. The metallic housing has an inner surface and an outer surface opposite to the inner surface, and the outer surface has a back side and lateral sides connecting with the back side. The inner surface is substantially a recessed structure. The metallic housing has a first gap communicating the inner surface and the outer surface, and the metallic housing further includes a second gap and at least one connecting terminal. The first non-conductive spacer is selectively disposed in the first gap of the metallic housing, and extends from a first side of the lateral sides of the metallic housing to the back side of the metallic housing.

A heat dissipation module manufacturing method, a heat dissipation module and an electronic device are provided. The heat dissipation module manufacturing method includes the steps: providing a first substrate, the first substrate has a first portion, a second portion, a connecting portion connected to the first portion and the second portion; performing a first etching on a surface of the first substrate to form a plurality of grooves; providing a plurality of second substrates, and bonding the second substrates to the first substrate to cover the grooves and form a plurality of chambers; filling the chambers with a working fluid; and sealing the chambers. The heat dissipation module includes the first substrate, the working fluid, and the second substrates. The electronic device includes the heat dissipation module and a plurality of electronic modules. The first portion and the second portion of the heat dissipation module respectively contact the electronic modules.

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Taoyuan, Taiwan

Chun-Lung Chu