Taiwan Semiconductor Manufacturing Comp. Ltd.

Chun-Liang Chen

Yee-Chia Yeo

Huicheng Chang

Liang-Yin Chen

Chia-Cheng Chen

Wei-Ting Chien

Chih-Kai Yang

In an embodiment, a method includes: placing a wafer on an implanter platen, the wafer including integrated circuit dies; measuring a position of the wafer by measuring a position of an outer edge of the integrated circuit dies with a camera; determining an angular displacement between the position of the wafer and a reference position of the wafer; and rotating the implanter platen by the angular displacement.

Wafer positioning method and apparatus

A method is disclosed that includes performing a directional ion implantation process on a developed resist pattern to reduce roughness. A substrate can be tilted at a tilt angle with respect to the direction of an incoming ion beam. Ions can be directionally implanted at the tilt angle, along sidewall surfaces of the developed resist pattern to trim roughness from the sidewall surfaces. After implanting, the substrate can be rotated along the axis normal to a surface, and ions can then be directionally implanted at the tilt angle along the sidewall surfaces to further trim roughness from the sidewall surfaces of the developed resist pattern. The directional ion implantation process can be performed over a number of iterations, and during each iteration of the directional ion implantation process, the tilt angle can be adjusted so that the tilt angle is different than during previous iterations.

Ion implantation method for reducing roughness of patterned resist lines

In an embodiment, a pattern transfer processing chamber includes a pattern transfer processing chamber and a loading area external to the pattern transfer processing chamber. The loading area is configured to transfer a wafer to or from the pattern transfer processing chamber. The loading area comprises a first region including a loadport, a second region including a load-lock between the first region and the pattern transfer processing chamber, and an embedded baking chamber configured to heat a patterned photoresist on the wafer.

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Hsinchu, Taiwan

Chun-Liang Chen