Taiwan Semiconductor Manufacturing Comp. Ltd.

Chun-Jung Huang

Yung-Lin Hsu

Kuang Huan Hsu

Po-Feng Tsai

Steven Huang

Jeff Chen

Yueh-Lun Yang

Li-Hsin Chu

Kuang-Huan Hsu

Henry Peng

Tsung Wei Chen

Chien-Fa Lee

Jen-Ti Wang

Yiang-Luen Lin

Sam Chin

Yu-Yao Huang

Hsu-Shui Liu

Wei-Chih Chen

Han-Wen Liao

Yung-Ho Chen

Shih-Ming Chin

Chih-Hung Liu

Hsiao-Wei Chen

An-sheng Chung

In an embodiment, a system, includes: a first pressurized load port interfaced with a workstation body; a second pressurized load port interfaced with the workstation body; the workstation body maintained at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first and second pressurized load ports at the set pressure level; a first modular tool interfaced with the first pressurized load port, wherein the first modular tool is configured to process the semiconductor workpiece; and a second modular tool interfaced with the second pressurized load port, wherein the second modular tool is configured to inspect the semiconductor workpiece processed by the first modular tool.

Modular pressurized workstation

The present disclosure describes a system and a method for an ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.

Method for an ion implantation process employing an ion-collecting device that collects a distribution of ejected ions from a target to correct a tilt angle of the target

A method for monitoring a transport vehicle is provided. The method includes the operations as follows. A transport vehicle is scanned by a monitor during the transport vehicle is operated on a rail to acquire a vehicle pattern of the transport vehicle. The vehicle pattern of the transport vehicle is analyzed. An abnormal transport vehicle is determined based on the vehicle pattern. The monitor is placed nearby the rail. A method for transport vehicle maintenance is also provided.

Method for monitoring transport vehicle and maintenance thereof

A planarization method includes forming a dielectric layer over a polish stop layer. The dielectric layer is polished until reaching the polish stop layer, and the polished dielectric layer has a concave top surface. A compensation layer is formed over the concave top surface. The compensation layer is polished.

Semiconductor structure and planarization method thereof

Method for ion implantation that adjusts a targets tilt angle based on a distribution of ejected ions from a target

The present disclosure describes a system and a method for a ion implantation (IMP) process. The system includes an ion implanter configured to scan an ion beam over a target for a range of angles, a tilting mechanism configured to support and tilt the target, an ion-collecting device configured to collect a distribution and a number of ejected ions from the ion beam scan over the target, and a control unit configured to adjust a tilt angle based on a correction angle determined based on the distribution and number of ejected ions.

Method for ion implantation that adjusts a target's tilt angle based on a distribution of ejected ions from a target

A fault detection method in a semiconductor fabricating factory is provided. The method includes delivering a test vehicle along a rail to a test region. The method further includes projecting a test signal from a transducer that is positioned on the test vehicle over a check board when the test vehicle is located within the test region. The check board and the test vehicle are arranged along an axis that is parallel to the rail. The method also includes performing an analysis of the test signal projected over the check board. In addition, the method includes issuing a warning alarm when an abnormality is detected based on the analysis result.

Fault detection method in semiconductor fabrication

An automated photomask storage and retrieval system includes a plurality of mobile storage units aligned in a first direction. Each mobile storage unit is movable in the first direction and includes a plurality of storage cells. A gantry is disposed over the plurality of mobile storage units. The gantry includes a supporting frame movable in the first direction. The plurality of mobile storage units interpose a pair of supporting members of the supporting frame. A beam connects the pair of supporting members and is movable along the pair of supporting members in a second direction perpendicular to the first direction. The beam includes a plurality of buffer cells. A robotic arm is disposed adjacent to the plurality of buffer cells and movable along the beam. The robotic arm is configured to transfer a container containing a photomask between a storage cell and a buffer cell.

Automated mask storage and retrieval system

A reticle purging system includes an automated pod opener, a reticle holding device, a reticle transporting device and at least one purging device. The reticle holding device has a reticle occupiable zone thereon. The reticle transporting device is assigned with a transportation path from the automated pod opener to the reticle holding device. The reticle occupiable zone is exposed to the purging device.

Reticle purging system and method thereof

Disclosed is a method and a system for monitoring of environment and security in a fabrication facility. In one embodiment, a method comprising: transporting an automated material handling system (AMHS) vehicle from a first position to a second position; and detecting at least one parameter using at least one sensor located on the AMHS vehicle to determine at least one environmental or security condition between the first and second positions.

Intelligent environmental and security monitoring system

A defect recognition system and a defect recognition method are described. The method includes inspecting a wafer to generate a defect map and locating at least one defect on the wafer by using the defect map; measuring at least one light component of light reflected from one of the at least one defect; comparing the at least one light component measured from the light reflected from the defect with a characteristic curve of the corresponding light component of the defect; and estimating an occurrence time of the defect based on the comparison.

Growing community of inventors

Yunlin County, Taiwan

Chun-Jung Huang