Lg Electronics Inc.

Chun Hyuk Ryu

Minjae Park

BongJun Kim

MinWoo Jeong

Jongkil Shin

An electronic device having heat dissipation function is proposed. The electronic device includes: a heating element () installed in a casing (C); a heat dissipation means () causing an ionic wind to flow into an inner space (S) of the casing (C); and a heat dissipation bridge (). The heat dissipation bridge () exchanges heat with the ionic wind flowing in the inner space (S) by protruding in a direction of the heating element () and at least a portion of the heat dissipation bridge is connected to a heat sink and transfers heat received from the heating element () to the heat sink. Accordingly, two means of the heat dissipation means () and the heat dissipation bridge () simultaneously cool the heating element (), so cooling efficiency is improved.

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Seoul, South Korea

Chun Hyuk Ryu