Advanced Semiconductor Engineering, Inc.

Chun-Hung Yeh

Gai-Lee Shen

Tsung-Wei Lu

Shao-Lun Yang

Wei-Chih Cho

Hong Jie Chen

Chung Ju Yu

Wei Shuen Kao

Vehicle front head lamp

Vehicle rear tail lamp

An electronic package and a method of manufacturing an electronic package are provided. The electronic package includes a carrier, an antenna substrate, and an electronic component. The carrier has a first surface and a second surface. The antenna substrate includes a resonant cavity and is disposed over the first surface. The antenna substrate is closer to the first surface than the second surface of the carrier. The electronic component is disposed between the antenna substrate and the second surface of the carrier.

Electronic package

The present disclosure provides a semiconductor device package and a method of manufacturing the same. The semiconductor device package includes a substrate, an interconnection structure, a package body, and a first electronic component. The interconnection structure is disposed on the substrate. The package body is disposed on the substrate and partially covers the interconnection structure. The package body has a position limiting structure around the interconnection structure. The first electronic component is disposed on the interconnection structure and electrically connected to the interconnection structure.

Semiconductor device package and method of manufacturing the same

A buckle locking structure device for a rear compartment cover of a pickup truck includes: a cross rod aluminum extrusion (); a slider (); a T-rod (); a buckle block (); a handle (); a T-insertion block (); and a frame body aluminum extrusion (); a lug () provided center of a bottom surface of the buckle block (); left and right semi-circular arc flanges () provided on the center of the bottom surface of the buckle block () on a and to left and right sides of the lug (), respectively; a left edge part slot () extending towards lug () and being engageable with the left semi-circular arc flange () of the buckle block () so that the left edge part slot () slides on the left semi-circular arc flange () of the buckle block () for fastening.

Buckle locking structure device for rear compartment cover of pickup trucks

Provided is a buckle locking device for the tonneau cover of pick-up trucks (II), which mainly comprises a load-bearing cross bar, a slider, a handle, a buckle block, a slide fixing block, a T-bar and an extruded aluminum frame, characterized in that: when the load-bearing cross bar and the slider is pressed by the handle of the buckle locking mechanism for buckling, it can generate a downward pulling force, which can be transmitted by the load-bearing cross bar to force the whole tonneau cover frame to generate a downward pressure, so that it can cover the truck bed tightly. Moreover, through the design of the slider mechanism, the T-bar can offer better stability and better positioning. When the buckle locking mechanism is not used, it can also be hidden inside the groove of the slider.

Buckle locking mechanism for the tonneau cover of pick-up trucks (II)

At least some embodiments of the present disclosure relate to a semiconductor package structure. The semiconductor package structure includes a substrate with a first surface, an encapsulant, an electronic component, and a patterned conductive layer. The encapsulant is disposed on the first surface of the substrate. The encapsulant includes a first surface and a second surface. The patterned conductive layer extends on the first surface and the second surface of the encapsulant and protrudes from the first surface and the second surface of the encapsulant. The electronic component is disposed on the patterned conductive layer.

Growing community of inventors

Kaohsiung, Taiwan

Chun-Hung Yeh