Advanced Semiconductor Engineering, Inc.

Chun Hung Tsai

Hsuan Yu Chen

Ian Hu

Meng-Kai Shih

Shin-Luh Tarng

Chenghan She

Kuo-Chih Huang

Kuan-Lin Yeh

A method for manufacturing an electronic package and a suction device are provided. The method includes: providing an electronic component having a first surface and including at least one conductive stud on the first surface; providing a suction device having at least one recess; and moving the electronic component with the suction device, wherein an edge of the at least one recess does not overlap the at least one conductive stud from a top view while moving the electronic component with the suction device.

Electronic package and suction device

A measuring system includes a temperature-variable container, an optical device and an air conditioner. The temperature-variable container includes a transparent plate. The optical device includes a first optical sensor unit and a second optical sensor unit. The air conditioner is disposed between the transparent plate and the optical device.

Measuring system

An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70&#xb0; to approximately 87&#xb0; with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90&#xb0; with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40&#xb0; to approximately 85&#xb0; with respect to the surface of the carrier.

Apparatus and method for measuring warpage

Growing community of inventors

Kaohsiung, Taiwan

Chun Hung Tsai