Industrial Technology Research Institute

Chun-Hsun Chu

Jung-Tai Chen

Yii-Tay Chiou

Bor-Chen Tsai

Lung-Tai Chen

Jui-Fen Pai

Tzong-Che Ho

Ching-Ian Chao

Chih-Hsiang Ko

Dao-Yang Huang

Ming-Lang Tsai

Ying-Chiang Hu

Chia-Yen Lee

Heng-Long Yang

Rung-Ywan Tsai

Fang-Chuan Ho

Ming-Chieh Chou

I-Cherng Chen

Wood-Hi Cheng

Nai-Hao Kuo

Chun-Te Chuang

Po-Hsun Sung

Wen-Shan Lin

Wen-Ying Chang

Jin-Sheng Chang

Zong-Yuan Wu

Chin-Sheng Chang

Ting-Chen Ke

Wen-Lo Shieh

Chih-Ting Kao

Ming Jie Chou

Shyi-Yi Chen

A micro-electro-mechanical system (MEMS) microphone module and a manufacturing process thereof are described. A thickness of a transparent temporary cover plate temporarily disposed in a conventional plastic package structure is adjusted. After a mold for a plastic protector is formed, an UV ray is utilized to irradiate the mold to reduce adherence on the temporary cover plate and a back surface of the MEMS acoustic wave sensing chip. Then, the temporary cover plate is removed, and the left space left is the main source for the back-volume of the MEMS microphone. Finally, a tag is covered on the plastic protector, so as to define the whole back-volume and form a closed back-volume. In the above-mentioned process, the size of the back-volume is the same as an area of the whole MEMS microphone chip. In addition, the back-volume can be defined.

MEMS microphone module and manufacturing process thereof

A gas detecting system, device and method use a variable pulse voltage waveform to increase the temperature of a detecting unit of the gas detecting system so it reacts with gas molecules from a particular space, and outputs a sensing signal. A processing unit of the gas detecting system then performs calculations on the sensing signal, such that an analysis unit may determine the presence of a target gas in the particular space, and further the composition and concentration of the target gas within the particular space, thus providing a detection that is accurate, rapid and convenient.

Gas detecting system, device and method

An inversed microphone module is provided. The module includes a substrate, a microphone chip, a back acoustic cavity cover, and a sealing material. The substrate has a plurality of connection pads and an acoustic hole. The microphone chip has a first surface and an opposite second surface. A plurality of electrically bonding portions and an acoustic sensing are disposed on the first surface. The microphone chip is electrically coupled to the connection pads of the substrate through the electrically bonding portions, and the acoustic hole corresponds to the acoustic sensing portion. The back acoustic cavity cover is fixed to the second surface and defines a back acoustic cavity with the acoustic sensing portion and the microphone chip. The sealing material encapsulates the microphone chip and covers the substrate, so that the sealing material, the substrate, the acoustic sensing portion, and the first surface define a front acoustic cavity.

Structure and manufacturing method of inversed microphone module and microphone chip component

A noise reduction device include at east a cavity; a plurality of ducts noise reduction, at least one of the ducts being connected to the cavity for transmitting an acoustic signal including a noise signal into/out of the cavity; a noise reduction circuit, for receiving the acoustic signal including the noise signal and generating an electrical signal; a microphone for receiving the acoustic signal inside the cavity, converting the received acoustic signal into another electrical signal and transmitting the electrical signal to the noise reduction circuit; and a speaker for receiving the electrical signal generated by the noise reduction circuit, using the received electrical signal to generate an out of phase acoustic signal accordingly, and feeding the out of phase acoustic signal into the cavity to interfere with the noise signal inside the cavity. With the noise reduction circuit and cavity structure designed in the noise reduction device, the full range of noise is attenuated.

Noise reduction device and method thereof

A flexible biomonitor comprises: a flexible substrate having a circuit apparatus, a hybrid sensor, a plurality of IC devices, a central processing module, a RF transmitter circuit, an antenna, and a power supply. Thereupon the flexible biomonitor can be plastered on the skin where the human body needs to be monitored to achieve the purposes of reducing occupied area, providing comfortable wear and achieve compactness, module expansion and EMI shielding. Besides, it is capable of remote real-time monitoring this signal to achieve the purpose of home care.

Flexible biomonitor with EMI shielding and module expansion

A self-aligned wafer or chip structure including a substrate, at least one first concave base, at least one second concave base, at least one connecting structure and at least one bump is provided. The substrate has a first surface and a second surface, and at least one pad is formed on the first surface. The first concave base is disposed on the first surface and electrically connected to the pad. The second concave base is disposed on the second surface. The connecting structure passes through the substrate and disposed between the first and second concave bases so as to be electrically connected to the first and second concave bases. The bump is filled in the second concave base and protrudes out of the second surface.

Self-aligned wafer or chip structure, and self-aligned stacked structure

At least one differential pressure sensing device has an active surface with an active region and a back surface with a recess. Next, a sacrificial layer is formed on a surface of the active region. Then, the differential pressure sensing device is bonded and electrically coupled with a surface of a carrier that has at least one through-hole corresponding to the recess of the differential pressure sensing device. Afterwards, at least one molding compound is formed to encapsulate the carrier and differential pressure sensing device while exposing the through-hole region and an upper surface of the sacrificial layer. Then, a solvent is used to naturally decompose the sacrificial layer, such that the active region of the differential pressure sensing device is exposed to atmosphere, thereby forming a differential pressure sensing device package with the through-hole.

Differential pressure sensing device and fabricating method therefor

A wafer level sensing package and manufacturing process thereof are described. The process includes providing a wafer having sensing chips, in which each sensing chip has a sensing area and pads; forming a stress release layer on a wafer surface; cladding a photoresist layer on the stress release layer; patterning the photoresist layer to expose the pads and a portion of the stress release layer, without exposing opening areas of the sensing areas; forming a conductive metal layer of re-distributed pads on the portion of the stress release layer exposed by the photoresist layer; removing the photoresist layer; forming a re-cladding photoresist layer on the stress release layer and the conductive metal layer; forming holes in the re-cladding photoresist layer above the re-distributed pad area; and forming conductive bumps in the holes to electrically connect to the conductive metal layer.

Wafer level sensing package and manufacturing process thereof

A device structure with preformed ring includes a sensor chip and a ring disposed and surrounded on periphery of sensitive area of an active surface thereof. The device structure with preformed ring may batchly bind and electrically connect to a carrier by a way of two-dimension array, and then a packaging process is performed. During the packaging process, the top portion of the ring can be used to against the inner side of a packaging mold, so as to stop the packaging material covering the device at outside of the ring and stick with the ring. Therefore, an opening is formed on the sensitive area surface of the device. Depending on the ring, the extra process for eliminating the packaging material on the sensitive area surface can be avoided in the conventional process.

Device structure with preformed ring and method therefor

A resistive-type humidity sensing structure with microbridge includes a substrate, a sensing portion, and two measuring electrodes. An isolated layer and a bridge are respectively formed on the substrate. The sensing portion includes a resistive and humidity sensing layer. Two measuring electrodes are formed on the resistive sensing layer corresponding to the bridge, so as to fix the sensing portion on the first isolated layer for measuring resistance values of the resistive sensing layer. The material of the humidity sensing layer changes its volume according to humidity, the length of the resistive sensing layer covered by the humidity sensing layer is warped, and the changes of the length of the material for the resistive sensing layer causes variations of the resistance value. Finally, two measuring electrodes are used to measure the humidity value.

Resistive-type humidity sensing structure with microbridge and method therefor

A package structure of a micro-electromechanical system (MEMS) type microphone is disclosed. The MEMS microphone comprises a substrate, a MEMS chip, an acoustic wave cover, and an encapsulant. The substrate has connection pads. The MEMS chip is electrically coupled to the connection pads. The MEMS chip includes an acoustic wave sensing portion. The acoustic wave cover is fixed on the MEMS chip for covering without contacting the acoustic wave sensing portion and defining an acoustic wave cavity space. The acoustic wave cover has an opening for allowing an acoustic wave to enter or exit out of the acoustic cavity space. The encapsulant encapsulates the substrate, the MEMS chip, and the acoustic wave cover, wherein a surface of the acoustic wave cover is exposed. The exposed surface of the acoustic wave cover is along the same level as the surface of the encapsulant.

Package structure of MEMS microphone

A humidity sensing structure having a cantilever resistor and a method for fabricating the same are disclosed. The method includes providing a substrate having a first surface and a second surface; performing an oxidation process on the first surface and the second surface to form a first oxide layer and a second oxide layer respectively; forming a resistance sensing layer on the first oxide layer; forming a humidity sensing layer on the resistance sensing layer; forming in the substrate a through-hole penetrating the first oxide layer and the second oxide layer; and forming a cantilever in the through-hole such that both the humidity sensing layer and the resistance sensing layer are secured in position on the cantilever. In response to humidity changes, the humidity sensing layer varies in volume and in consequence the resistance sensing layer varies in length, allowing ambient humidity to be measured.

Humidity sensing structure having a cantilever resistor and method for fabricating the same

The apparatus for sensing plural gases is substantially a gas sensor adopting planar lightwave circuit for constructing reference optical path and sensing optical path, which is a flat structure with abilities of high accuracy, long-term stability, and short response time. The gas sensor can be widely applied for monitoring the safety of a working environment, securing the safety of workers, alerting potential hazard in a factory, inspecting harmful materials in a specific area, testing leakage of a pipeline, inspecting waste gas exhausted from automobile/motorcycle, and monitoring the living quality of household environment.

Apparatus for sensing plural gases

An electrode and a method for forming the electrode. The electrode comprises: a substrate; and a plurality of metal particles adhering to the substrate. The method comprises steps of: providing a substrate; providing a solution including a solvent and a plurality of metal particles on the substrate; removing the solvent; and making the plurality of metal particles adhere to the substrate.

Electrode and method for forming the same

An illumination module is disclosed, which is comprised of a plurality of light sources, a plurality of light source substrates of high thermal conductivity, and a reflecting member for reflecting light. The plural light source substrates are arranged at positions corresponding to each other so as to form a polygon periphery of the illumination module, whereas the inner surface of the polygon periphery is enabled for at least one of the plural light sources to fit therein. The reflecting member is placed at the center of the module where it is corresponding to each of the plural light source substrates so as to reflect the light emitting from the light sources fitted thereon. In addition, a lens with light refraction ability is disposed at the light emitting end of the illumination module so as to enable the light illumination module to have light condensing/diffusing capability. Moreover, each light source substrate further comprises: a plurality of heat dissipating fins, being arranged at the outer surface thereof; and a assistant heat dissipating device; wherein the working range of the operation power and the luminous flux of the illumination module can be increased by the combined function provided by the heat dissipating fins and the assistant heat dissipating device. The assistant heat dissipating device can further comprise: a fan, being arranged at the bottom of the illumination module; and a heat pipe device, being fitted onto the light source substrate, for conducting waste heat to the heat dissipating fins to be dissipated.

Growing community of inventors

Tainan, Taiwan

Chun-Hsun Chu