Chang Chun Plastics Co., Ltd.

Chun-Hsiung Kao

An-Pang Tu

Kuen-Yuan Hwang

Mong Song Liang

Ping-Chieh Wang

Gai-Chi Chen

Fang-Hsien Su

Chi-Yi Ju

Sheng-Yen Wu

Fang-Shian Su

Chi-Hung Liu

Phosphorous containing compounds, epoxy resins thereof, and laminate composite structures thereof. The phosphorus containing compounds may have a structure according to formula (I): wherein, X is an aromatic hydrocarbon group having 6 to 30 carbon atoms or a bivalent linear or branched alkylene group of 1 to 8 carbon atoms; Ris selected from an alkyl group having 1 to 6 carbon atoms, a phenyl group, a napthyl group, and an aromatic phenol group; w is an integer of 1 to 9; R, R, R, and Rare independently selected from H, C-Calkyl, C-Calkoxy, and C-Ccycloalkyl; Ris selected from the group consisting of C-Calkyl, C-Calkoxy, C-Ccycloalkyl, and Ar; and Arand Arare independently selected.

Phosphorus containing compounds and epoxy resins thereof

A phosphorus-containing epoxy resin and a method for synthesizing the same are disclosed. The method includes the step of catalytically reacting compound (i) with compound (ii) to synthesize the phosphorus-containing epoxy resin having the structure of compound (I). R is methyl or phenyl, and n is the integer from 1 to 9. 

Phosphorus-containing epoxy resin and method for synthesizing the same

Disclosed is a halogen-free resin composition comprising: (A) one or more phosphorus-containing epoxy resins; (B) a hardener; (C) a hardening accelerator; (D) a polyphenylene oxide resin; and (E) a filling material, wherein the hardener of component B has the structure represented by the following formula (I):wherein each symbol is as defined above. The halogen-free resin composition of the present invention without adding halogen has excellent heat resistance and flame retardant property, and excellent dielectric property. The halogen-free resin composition of the present invention is particularly useful in the application of bonding sheets, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials and the like.

Halogen-free resin composition

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Hsinchu County, Taiwan

Chun-Hsiung Kao