Acer Inc.

United Microelectronics Corp.

Chun-Hsien Wu

Chien-Hung Zordius Chen

Yan-Lin Kuo

Shun-Bin Chen

Chen-Hsien Hsu

Wei-Jen Wang

Chien-Fu Chen

Chih-Wei Liao

Chung-Jen Ho

Wen-Chieh Chen

Chia-Chieh Liu

Kuan-Chang Huang

A hinge structure is adapted to connect two objects for the two objects rotating with respect to each other. The hinge structure includes a first member, a second member, a third member, and an elastic assembly. The first and the third members are respectively assembled to the two objects. The second member pivoted to the first member rotates about an axis relative to the first member. The third member pivoted to the second member rotates about the axis relative to the second member. In a first state, the second member is accommodated in a recess of the first member. In a second state, the second member moves with the third member and at least a portion of the second member is moved out of the recess. The elastic assembly connected between the first and the third members constantly moves the second member into the recess to maintain the first state.

Hinge structure

An integrated circuit layout structure having dual-height standard cells includes at least a first standard cell including a first cell height and at least a second standard cell including a second cell height. The second cell height is one half of the first cell height. The first standard cell includes one first doped region formed in a middle of the first standard cell and a plurality of second doped regions formed at a top side and a bottom side of the first standard cell. The first doped region includes a first conductivity type and the second doped regions include a second conductivity type complementary to the first conductivity type. And an area of the first doped region is smaller than an area of the total second doped regions.

Integrated circuit layout structure

A hinge structure includes a first bracket, a second bracket, a first fixing member connected to the first bracket, a second fixing member connected to the second bracket, a first linking member, a second linking member, a first resilient member, a second resilient member, a first linking bar pivotally connected to the second bracket, a second linking bar pivotally connected to the first bracket, a first sliding member and a second sliding member. The first linking member and the first resilient member are disposed on the first fixing member. The second linking member and the second resilient member are disposed on the second fixing member. The first linking bar is pivotally connected to the second linking bar. The first sliding member is connected to the first linking member and the first linking bar. The second sliding member is connected to the second linking member and the second linking bar.

Electronic device and hinge structure

A method for designing a semiconductor layout structure includes following steps. A first active feature group including at least a first active feature is received, and the first active feature includes a first channel length. A pair of first dummy features is introduced to form a first cell pattern. The first dummy features include a first dummy width. A first spacing width is defined between the first active feature group and one of the first dummy features and a third spacing width is defined between the first active feature group and the other first dummy feature. The first cell pattern includes a first cell width and a first poly pitch, and the first cell width is a multiple of the first pitch. The receiving of the first active feature group and the introducing of the first dummy features are performed in by at least a computer-aided design tool.

Semiconductor layout structure and designing method thereof

A component-positioning module comprises an elastic member, a plurality of fastening members, a plurality of adjustment elements and a positioning element. The elastic member is secured to a first component of the electronic device by the plurality of fastening members, and an operative portion of the elastic member is movable in a linear extension direction substantially perpendicular to an outer surface of the first component. The plurality of adjustment elements are secured between the elastic member and the first component by the fastening members respectively; the positioning element is combined with the operative portion to position a second component of the electronic device, and the positioning element at least partially protrudes from the outer surface. Manipulation of the plurality of fastening members deforms the plurality of adjustment elements and changes a distance of the positioning element protruding from the outer surface.

Growing community of inventors

Taipei, Taiwan

Chun-Hsien Wu