Applied Materials Israel Limited

Chun-Hsiang Yen

Yuval Gronau

Barak Dee-Noor

Boaz Cohen

Efim Vinnitsky

Shih-Wei Yang

Yohanan Madmon

Albert Kao

Yen Cheng Chiang

Ching-Hung Lai

Ronen Hagai

Chenwei Huang

There is provided a system and method of examination of a semiconductor specimen. The method includes obtaining a group of defect candidates associated with respective inspection locations represented in an inspection coordinate system; using a trained machine learning (ML) model to provide, for each defect candidate, a probability of the defect candidate being a defect of interest (DOI), and ranking the group of defect candidates to an ordered list according to respective probabilities thereof, in response to a part of the ordered list of defect candidates being reviewed by a review tool in accordance with an order thereof, receiving a predefined number of DOIs associated with respective review locations represented in a review coordinate system; and calculating an offset between the review coordinate system and the inspection coordinate system based on respective inspection and review locations associated with the predefined number of DOIs.

Defect offset correction for examination of semiconductor specimens

A system that may include a movable support module for supporting an object and a controller, wherein the controller is configured to: receive an estimated location of a movable support module that supports an object and temperature information about an actual or estimated temperature of at least a portion of the object support module; and calculate movable support module location information, in response to (a) the estimated location of the movable support module, (b) the temperature information, and (c) a mapping between (i) values of the temperature information, (ii) estimated locations of the movable support module, and (iii) location errors of the movable support module.

Temperature sensitive location error compensation

A system that may include a chamber, a motorized system, a chuck, a controller, multiple temperature sensors and a cooling module; wherein the chuck is configured to support an object that is positioned within the chamber; wherein the motorized system is configured to move the chuck in relation to the chamber; wherein the multiple temperature sensors are configured to sense multiple temperatures of at least one point within the chamber; wherein the cooling module is configured to cool a unit of the motorized system; and wherein the controller is configured to control the cooling module in response to the multiple temperatures.

System and method for setting a temperature of an object within a chamber

Growing community of inventors

Magong, Taiwan

Chun-Hsiang Yen