Industrial Technology Research Institute

Chun-Hao Chang

Guo-Shing Huang

Chuan-Sheng Zhuang

Hui-Ta Chen

Li-Wen Lai

Tung-Ying Lin

Ming-Hsien Ko

Shih-Chieh Liao

Sung-Ho Liu

Ching-Chih Lin

Kun-Wei Lin

Tai-Hung Chen

Chun-Ting Chen

Chun-Hao Tseng

Teng-Yen Wabg

Chih-Hung Kao

Wei-Yu Chen

Yi-Long Wang

Herrison Wang

The invention provides a flexible base material and a flexible electronic device. The flexible base material includes a flexible substrate having a first surface and a second surface opposite to the first surface. A first organic composite barrier layer is deposited on the first surface of the flexible substrate, wherein the first organic composite barrier layer applies a first stress to the flexible substrate. An anti-curved layer is deposited on the second surface of the flexible substrate, wherein the anti-curved layer applies a second stress to the flexible substrate, and wherein the second stress applied by the anti-curved layer cancels off more than 90% of the first stress.

Flexible base material and flexible electronic device

A method for forming a parylene film is provided, which includes following steps. Providing a chemical vapor deposition apparatus including a buffer chamber having first and second valves and a rotative carrying apparatus, an evaporator connected with the second valve, a pyrolysis chamber connected with the evaporator, and a deposition chamber connected with the pyrolysis chamber. Placing a parylene material in the rotative carrying apparatus of the buffer chamber through the first valve. Turning off the first and second valves and balancing a pressure in the buffer chamber and a pressure in the evaporator. Turning on the second valve and delivering the parylene material into the evaporator. Evaporating the parylene material in the evaporator to form a parylene gas. Pyrolyzing the parylene gas in the pyrolysis chamber to form a parylene monomer. Delivering the parylene monomer to the deposition chamber for deposition so as to form a parylene film.

Method of forming parylene film

A plasma excitation module including a chamber, a plurality of coils and a multi-duct gas intake system is provided. The chamber has a dielectric layer. The coils are disposed at an outer side of the dielectric layer, and the coils are separated from each other by an interval and in parallel connection. The multi-duct gas intake system surrounds the dielectric layer and is communicated with the chamber.

Plasma excitation module

A method of forming an organic film is provided and includes followings. An apparatus is provided and includes a gas storage chamber, an evaporator, a pressure gauge, a pyrolysis chamber connected with the gas storage chamber, and a deposition chamber. The evaporator connects with the pyrolysis chamber through the gas storage. An organic material in the evaporator is evaporated to form organic gas, wherein the organic gas is passed into the gas storage chamber. When pressure of the organic gas in the gas storage chamber, measured by the pressure gauge, reaches a predetermined value, a valve between the evaporator and the gas storage chamber is turned off and another valve is turned on for passing the organic gas into the pyrolysis chamber. The organic gas is pyrolyzed in the pyrolysis chamber to form a monomer. The monomer is delivered to the deposition chamber for deposition to form an organic film.

Method of forming organic film

A plasma assisted apparatus for organic film deposition, comprising: a plasma chamber, capable of thermally cracking a precursor in the plasma chamber; and a deposition chamber, being channeled with the plasma chamber for receiving the thermally cracked precursor. In an exemplary embodiment, the deposition chamber further comprises a substrate device, being provided for the thermally cracked precursor to deposit thereon to form an organic film. As the plasma chamber is separated from the deposition chamber in the aforesaid apparatus, a low-temperature film deposition process can be used for forming organic films while preventing the substrate device from being bombarded directly by plasma. In addition, as there is a flow guiding device arranged at the outlet of the plasma chamber, the thermally cracked precursor is guided or disturbed and thus is prevented from overly concentrating at the outlet or the center of the substrate device. Thereby, surface roughness as well as uniformity of the organic film can be effectively improved.

Plasma assisted apparatus for organic film deposition

A method for forming gas barriers on electronic devices is provided. The fabrication method includes: providing a first substrate having at least one electronic device thereon; providing a second substrate and forming a gas barrier over the second substrate; disposing the second substrate over the first substrate, wherein the gas barrier faces the electronic device; providing an electromagnetic wave light source over the second substrate; and irradiating the second substrate by the electromagnetic wave light source to transfer the gas barrier to the electronic device and cover the electronic device.

Methods for forming gas barriers on electronic devices

A method and an apparatus for inspecting radio frequency identification (RFID) tags which utilize a way of shielding for inspecting whether RFID tags function properly or not. The method of the present invention comprises steps of: reading a plurality of RFID tags in a readable zone; and determining whether there is any malfunctional RFID tag in the plurality of RFID tags. If all the plurality of RFID tags function properly, the method will check a next plurality of RFID tags. If there is at least one unreadable RFID tag, the at least one malfunctional RFID tag will be found by shielding one or the plurality of RFID tags. By means of the disclosure in the present invention, the present method and apparatus are capable of improving the efficiency during inspection and simplifying the design of a readable zone.

Method and apparatus for inspecting radio frequency identification tags

A wafer bonding method, comprising steps of: coating a medium layer respectively on the surfaces of two wafers; removing impurities formed on the surface of each medium layer; laminating the two wafers while enabling the surface coated with the medium layer of one of the two wafers to face the surface coated with the medium layer of another wafer; and applying an ultra-sonic oscillation and a bonding pressure upon the laminated wafers for bonding the two wafers.

Growing community of inventors

Kaohsiung County, Taiwan

Chun-Hao Chang