Benq Corporation

Hewlett Packard Enterprise Development LP

National Taiwan University

Chun-han Lin

Chin-Fu Chiang

Chuang-Wei Wu

Chen-Chi Wu

Chia-Nan Shih

Jung-Kun Tseng

Chen-Cheng Huang

Chih-Chung Yang

Horng-Shyang Chen

Ku-Hsu Nien

Chia-Ying Su

Tse-Jen Sung

Geoffrey Sun

Chang Yu Chen

An optical engine device with a heat dissipation function suitable for providing projection light of a projector includes a heat conductive casing, a phosphor wheel structure and a heat dissipation module. The phosphor wheel structure is disposed in the heat conductive casing. The heat dissipation module includes a channel member and a flow generation device. The channel member is disposed corresponding to the phosphor wheel structure in the heat conductive casing and has a guide channel and a nozzle extending from an outlet of the guide channel and facing a back side of the phosphor wheel structure. The flow generation device is connected to an inlet of the guide channel to generate an airflow flowing into the guide channel and passing through the nozzle for forming an impact flow toward the back side of the phosphor wheel structure.

Optical engine device with heat dissipation function and projector thereof

A transmitter device adapted to be coupled to an image providing device and a receiver device includes first and second conversion units, a wireless module, and a processing unit. The first conversion unit and the second conversion unit are configured to be coupled to the image providing device through an HDMI transmission cable and a Type-C transmission cable, respectively, so as to respectively receive a first video and audio stream and a second video and audio stream provided by the image providing device. The wireless module is connected to the receiver device through wireless communication. The processing unit preferentially selects the first conversion unit to receive a first video and audio signal output by converting the first video and audio stream by the first conversion unit and transmits the first video and audio signal to the receiver device through the wireless module.

Transmitter device

A video streaming transmission system and a transmitter device are provided. The video streaming transmission system includes a receiver device and a transmitter device. The receiver device is coupled to a display module. The transmitter device is coupled to an image providing device through a transmission line. The transmitter device includes a processing unit, a storage unit, and a wireless communication module. The storage unit is coupled to the processing unit. The wireless communication module is coupled to the processing unit, and is coupled to the receiver device in a wireless communication manner. The processing unit generates virtual extended display identification data and stores them in the storage unit, and provides the virtual extended display identification data to the image providing device through the transmission line, so that the image providing device recognizes multiple virtual displays coupled thereto, and outputs multiple video streams through the transmission line.

Video streaming transmission system and transmitter device

Examples herein relate to server systems with hinge mechanisms. In one example, a server system includes a first enclosure and a second enclosure, the first and second enclosure each include a front end and a back end disposed opposite to each other, the front end having an opening. The server system further includes a hinge mechanism, the hinge mechanism connecting an upper edge of the back end of the first enclosure to an upper edge of the front end of the second enclosure. The first enclosure is adapted to rotate around the hinge mechanism.

Server systems with hinge mechanisms

A semiconductor device including a Si (110) substrate, a buffer layer, a first type doped semiconductor layer, a light-emitting layer and a second type doped semiconductor layer is provided. The Si (110) substrate has a plurality of trenches. Each trench at least extends along a first direction, and the first direction is parallel to a &#x3c;1-10&#x3e; crystal direction of the Si (110) substrate. The buffer layer is located on the Si (110) substrate and exposes the trenches. The first type doped semiconductor layer is located on the buffer layer and covers the trenches. The light-emitting layer is located on the first type doped semiconductor layer. The second type doped semiconductor layer is located on the light-emitting layer. A fabrication method of a semiconductor device is also provided.

Semiconductor device having trench and fabrication method thereof

Growing community of inventors

Taipei, Taiwan

Chun-han Lin