Advanced Semiconductor Engineering, Inc.

Other

Chun-Han Chen

Hsun-Wei Chan

Mei-Yi Wu

Chin-Chang Wu

Hsin-Ying Ho

Ya-Tsung Feng

Chang Chin Tsai

Li-Hsiang Lai

Ming-Sheng Kao

The present disclosure relates to a semiconductor device package, which includes a carrier, a lid, a first adhesive layer and a constraint structure. The carrier includes a surface and a first conductive pad on the surface of the carrier. The lid includes a first portion and a second portion separated from the first portion on the surface of the carrier. The first conductive pad is disposed between the first portion of the lid and the surface of the carrier. The first adhesive layer includes a first portion between the first portion of the lid and the first conductive pad. The constraint structure surrounds the first adhesive layer.

Lid structure and semiconductor device package including the same

A semiconductor package includes a first substrate having a first surface, a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface adjacent to the first surface, and the first surface of the second substrate being disposed on the first surface of the first substrate, and a light source on the second surface of the second substrate. A method for manufacturing the semiconductor device package is also provided.

Semiconductor device package, optical package, and method for manufacturing the same

A DC to AC inverter has a DC power input port, a buck converter, a buck/boost converter, an output filter and an AC output port. The DC power input port has a positive input terminal and a negative input terminal, both connected to a DC source. The AC output port is connected to a single-phase utility system. When the single-phase utility system is in positive half cycle, the buck converter generates a positive half-cycle signal of sinusoidal current. When the single-phase utility system is in negative half cycle, the buck/boost converter generates a negative half-cycle signal of sinusoidal current. In either the positive or negative half cycles, only one power electronic switch is switched in high frequency to reduce switching loss. Further, the negative input terminal of the DC power input port of the invention can be connected to a neutral line of the single-phase utility system.

DC to AC inverter

Growing community of inventors

Kaohsiung, Taiwan

Chun-Han Chen