Asustek Computer Inc.

Chun-Chieh Wu

Hung-Chun Chu

Hsi-Feng Lin

An electronic apparatus includes a case, a circuit board disposed in the case, a heat sink backplate module, and a heat sink disposed on a heat source of the circuit board. The heat sink backplate module is disposed on a surface of the circuit board opposite to the heat source. The heat sink backplate module includes a body having a plurality of holes, at least a heat pipe, a fins assembly, and a heat spreader. The pluralities of fixing elements of the heat sink are fixed in the holes such that the heat sink is disposed firmly on the heat source. The heat spreader is disposed on a surface close to the circuit board. The heat pipe passing through the body is suitable for heat conducting from the bottom of the circuit board to the fins assembly so that the temperature of the bottom of the circuit board is decreased.

Heat sink backplate module, circuit board, and electronic apparatus having the same

An electronic device has a first circuit board, a first fan, a second circuit board, a first heat sink, and a first air ventilation duct. The first fan and the first circuit board are electrically connected together. The second circuit board is electrically connected to the first circuit board; the first heat sink is electrically connected to the second circuit board; and the first air ventilation duct is connected to the first fan and the first heat sink. The first heat sink introduce the heat generated by the electronic element on the second circuit board to the first fan for better cooling performance. Therefore, the present invention requires only the first fan and the second fan, but is able to provide high cooling efficiencies with a low noise signature.

Growing community of inventors

Taipei, Taiwan

Chun-Chieh Wu